Nordson SELECT to Present at SMTA Guadalajara Expo and Tech Forum


Reading time ( words)

Nordson SELECT, a Nordson company, and a global provider of selective soldering systems, is pleased to announce Bob Klenke, technical consultant, will present “Selective Soldering of Challenging Components” at the SMTA Guadalajara Expo and Tech Forum on October 24, 2019 at Expo Guadalajara in Guadalajara, Mexico.

Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Fine-pitch micro-connectors, compact peripheral component interface (cPCI) connectors, dual in-line memory module (DIMM) connectors, coax connectors and other high thermal mass components can present challenges when soldered into multilayer printed circuit board assemblies, heavy backplanes or high-density interface (HDI) boards. 

Compact peripheral component interface connectors especially present solderability issues due to their beryllium copper termination pins. This presentation is based on real-world consulting experience with selective soldering and details the appropriate process controls necessary to obtain optimal solderability. Best practices together with many hands-on solutions for improving manufacturing yields and solder joint integrity will be discussed in detail.

This presentation is intended for process engineers, manufacturing engineers, shop floor technicians, as well as manufacturing and quality personnel who are experienced in SMT and through-hole assembly who want to further their expertise in implementing and troubleshooting the processes, equipment, and materials involved in modern electronic assembly technology.

Bob Klenke is a technical consultant with Nordson SELECT as well as a principal consultant with ITM Consulting, a full service technical consulting and market research firm serving the electronics assembly industry. His expertise includes process optimization, process troubleshooting and value-added defect resolution strategies. He has more than 30 years of experience with electronics assembly and is a frequent workshop instructor for selective soldering and wave soldering courses at APEX and SMTA International conferences.

About Nordson SELECT

Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo® standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno® in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra multi-station modular systems designed to meet the most challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput. To find out more, visit www.nordsonSELECT.com, or on social media.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries. Visit Nordson on the web at http://www.nordson.com.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.