SMTAI 2019: Carmichael Gugliotti Discusses His First SMTAI Paper


Reading time ( words)

Carmichael Gugliotti, process specialist at MacDermid Alpha Electronics Solutions, discusses his first STMAI paper presentation with Andy Shaughnessy. Gugliotti's paper focuses on periodic pulse plating of mid-aspect ratio PCBs.

To watch the interview, click here.

Share

Print


Suggested Items

Tips to Improve Soldering Tip Life and Reduce Cost

10/10/2018 | Thermaltronics
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating – Influence of Electroless Pd Plating Film Thickness

06/20/2017 | Yoshinori Ejiri, et al., Hitachi Chemical Co. Ltd
This paper investigated the influence of Pd film thickness in electroless Ni/Pd/Au plating on the solder ball joint reliability. It was found out that the shape and thickness of the intermetallic compounds (IMCs) are among the key factors that affect solder joint reliability after multiple reflow cycles and thermal aging, respectively.

Plating and Surface Finish: Assemblers' POV

01/13/2017 | Stephen Las Marias, I-Connect007
Joemar Apolinario and Dnichols Dulang of EMS firm Integrated Micro-Electronics Inc. discuss with SMT Magazine the impact of plating and surface finishes on electronics assemblies. They highlight the impact on solderability, the problems with complex components and packages, as well as parameters to consider when it comes to surface finish selection.



Copyright © 2020 I-Connect007. All rights reserved.