Reading time ( words)
Meet Ray Prasad, one of our SMT007 columnists! Prasad’s columns explore DFM, manufacturing processes, yield improvement, quality control, IPC standards, and much more.
Ray Prasad is the president of Ray Prasad Consultancy Group and author of the textbook Surface Mount Technology: Principles and Practice. Prasad is also an inductee to the IPC Hall of Fame—the highest honor in the electronics industry—and has decades of experience in all areas of SMT, including his leadership roles implementing SMT at Boeing and Intel; helping OEM and EMS clients across the globe set up strong, internal, self-sustaining SMT infrastructure; and teaching on-site, in-depth SMT classes.
Read “SMT Solver” in SMT007 Magazine. Subscribe today!
Share
Suggested Items
Essemtec: Manufacturing Moves In-house
12/28/2022 |
Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.
SMT Tooling, PSA: 'Perfect Marriage of Innovation and Product'
10/26/2022 |
Nolan Johnson, I-Connect007
Jeffrey Pulaski describes the recent partnership between SMT Tooling and PSA, which brings SMT Tooling’s innovation and PSA’s manufacturing capabilities together. Pulaski also shares news on product development, and what visitors to SMTA International can expect to see in SMT Tooling’s floor presence.
I-Connect007 eBook Introduction: The Evolving NPI Process
08/25/2022 |
I-Connect007 Editorial Team
Thanks to marketing and advances in technology, we have all come to expect that the electronic products we buy will be closely aligned to our individual and specific lifestyle or business requirements. This expected variability, in personal function and style, as well as regulatory compliance and a changing global economic landscape, has made designing and producing new products a challenging prospect. And, on top of the resulting “high-mix, low-volume” production cycles, increasingly more products contain electronic components in varying levels that heighten the complexity of design and manufacturing.
