Sign up Now for the SMTA Oregon Chapter Meeting Nov. 21

Reading time ( words)

The Oregon Chapter of the SMTA will meet at Axiom Electronics on November 21 from 4-7 pm for a presentation by Dale Lee of Plexus.

His discussion is titled “Tolerance Mistaken: Impacts of not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations.”

Presentation Highlights

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume.  The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces.  However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. 

This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.

About the Speaker

Dale Lee is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields. Dale has been involved in surface mount design, package and process development and production for over 30 years in various technical and managerial positions.  

Date
November 21, 2019
Time
4-7 pm
Place
Axiom Electronics
9845 NE Eckert Drive Suite 200
Hillsboro, Oregon 97006

To RSVP for this event, click here.

05/04/2022 | Nolan Johnson, I-Connect007

VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

03/29/2022 | Barry Matties, I-Connect007

Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

03/14/2022 | Patty Goldman, I-Connect007

The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.