Sign up Now for the SMTA Oregon Chapter Meeting Nov. 21


Reading time ( words)

The Oregon Chapter of the SMTA will meet at Axiom Electronics on November 21 from 4-7 pm for a presentation by Dale Lee of Plexus.

His discussion is titled “Tolerance Mistaken: Impacts of not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations.”

Presentation Highlights

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume.  The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces.  However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. 

This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.

About the Speaker

Dale Lee is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields. Dale has been involved in surface mount design, package and process development and production for over 30 years in various technical and managerial positions.  

Date
November 21, 2019
Time
4-7 pm
Place
Axiom Electronics
9845 NE Eckert Drive Suite 200
Hillsboro, Oregon 97006

To RSVP for this event, click here.

Share




Suggested Items

Real Time with … IPC APEX EXPO 2023: Mycronic Extends Reach

01/11/2023 | Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.

Five-Star Reflow Recipes: Q&A With Rob Rowland

12/28/2022 | Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”

Essemtec: Manufacturing Moves In-house

12/28/2022 | Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.