MIRTEC Europe Wins Best of Industry Award


Reading time ( words)

MIRTEC, “The Global Leader in Inspection Technology,” has won an EM Best of Industry Award in the category of Automated Optical Inspection for its MV-6e OMNI. The award was presented to Bentec distributor Accurex Solutions during a ceremony on 26 September at the Stellar Gymkhana in India. Bentec is MIRTEC’s managing partner for UK/Ireland and India.

“We are honored to have won a 2019 Best of Industry award from Electronics Maker,” said David Bennett, managing director of Bentec Ltd. “Earning more than 40 industry awards for our technologically advanced inspection solutions lets us know that we are on the right path to providing our customers with the best quality products and services available today.”

Mirtec.JPG

MIRTEC’s industry acclaimed MV-6e OMNI 3D AOI machines are configured with the company’s exclusive OMNI-VISION® 3D inspection system, which combines 15 megapixel CoaXPress camera technology with MIRTEC’s revolutionary digital tri-frequency Moiré 3D system. This proprietary system yields precise height measurement data used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured, the MV-6 OMNI systems feature four 18 megapixel side-view cameras in addition to the 15 megapixel CoaXPress top-down camera as well as an eight-phase lighting system to provide precision inspection of SMT devices on finished PCB assemblies.  

The EM Best of Industry awards program started in 2015 and is organised by India’s leading electronics magazine, Electronics Maker. The award honors leading performers in the industry that drive the industry forward, providing them with a platform to showcase their achievements and product successes. This will help in furthering the growth of the electronics industry, challenging technology to reach the next level.

About MIRTEC

MIRTEC is a leading global supplier of automated optical inspection systems to the electronics manufacturing industry. For further information, visit www.mirtec.com.

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow

05/05/2020 | Donna Vareha-Walsh, Indium
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.



Copyright © 2020 I-Connect007. All rights reserved.