-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Mek to Showcase Latest Range of AOI Technology at IPC APEX
November 27, 2019 | Mek (Marantz Electronics)Estimated reading time: 3 minutes
Mek (Marantz Electronics), will be showcasing the ISO-Spector M1 Full 3D AOI system with Artificial Intelligence at this year’s Apex in San Diego on booth 3029.
One of the greatest challenges in programming AOI, (Automatic Optical Inspection) systems is the detection of all non-conforming placements, especially those related to solder joints, without creating a long list of ‘’False Calls’’. The industry has always faced this problem and has had to accept that the more accurately you wish to measure, the more false judgements a system will make. It commonly results in long debugging time and complex programming.
The full 3D ISO-Spector M1A delivers a self-learning algorithm for solder joint inspection that will detect any deviation outside the expected standard appearance of a solder joint. A proprietary solution with Artificial Intelligence is continuously and centrally monitoring production and adjusting hundreds of tolerance values where needed to maximize detection and minimize false calls. The programmer does not have to specify the specific inspection locations, light settings or acceptance criteria. This not only reduces programming time, but more importantly removes the often-unpredictable human variable to ensure that the inspection results are more reliable.
Also being demonstrated at the show is the desktop PowerSpector GTAz designed for maximum defect coverage whilst maintaining short programming times. It is the only desktop AOI in the market that can be equipped with 9 cameras: 1 top and 8 side cameras. For maximum flexibility, the optical unit is configurable to fit your needs today while providing upgrade possibilities for the future.
Completing the line-up of inspection solutions on the booth is a demonstration of the modularity of the SpectorBOX AOI system. SpectorBOX is uniquely engineered to accommodate solder frames on return and/or feed conveyors. The system offers bottom side, top side, simultaneous dual side inspection or conformal coating inspection, deploying up to 18 cameras, Z axis positioning and auto-focus. SpectorBOX GTAz Bottom-Up AOI is optimized (besides SMT inspection) for the inspection of THT solder joints to identify defects such as presence/absence of solder, wetting problems, meniscus shape, pin insertion problems, bridges with automated 9-image microscopic presentation for classification and repair. SpectorBOX JUz CCI is the ultimate solution for conformal coating inspection. It can be used after manual spray, automatic spray and dip coating applications. The system is able to provide coating defect detection covering the components and around the components. Bubbles and other contaminations can also be detected.
The Nutek Main Frame allows easy integration of one or two SpectorBOX modular AOI systems into the production line and will be displayed at Apex with the bottom up THT AOI and the SpectorBOX JUZ CCI.
Mek offers a complete line of inspection equipment for maximized defects coverage.
The Mek PowerSpector BTL AOI system offers synchronized inspection of the top and bottom side of PCBs after Reflow, Wave or Selective soldering & placement of SMT & THT components. Patented synchronized lighting technology delivers new capabilities. 9 cameras per side, with both heads inspecting the PCB at the same time, deliver fastest inspection times but without the high power lighting system of each head affecting the other inspection taking place. The elimination of flipping removes potential for stress on the assembly and improves long term reliability of solder joints.
For customers for whom value for money is an absolute priority Mek offers two systems in the entry level range. The new iSpector JK desktop AOI system is designed to inspect component bodies and solder joints by use of RGB LED light sources from three different angles offering full inspection coverage at an entry level price. Powerful algorithms achieve an optimal balance between defect detection and false reject levels in the shortest time.
Available as a desktop or inline system the Mek iSpector JDz delivers the fastest return on investment for EMS customers that seek optical flexibility, easy programming & usage and the highest inspection performance guarantees. The JDz uses a Z-axis for maximum flexibility in THT and sandwiched SMD inspection. The Z-axis enables inspection of objects at different height levels such as sandwiched PCB’s, tall components or positional measurement of tall connector pins.
As well as AOI solutions Mek offers 5D post-print solder paste inspection systems which deliver first rate defect detection. Combining 3D and 2D image processing methodologies Mek ISO-Spector S2 uses MEKs unique production control method, to monitor process stability and reduce tolerance. This is ideally suited to go beyond process control after the print process has been optimized and monitor the users process capability to prevent process drift.
For more information on Mek and the entire range of products visit www.marantz-electronics.com, or visit us at booth 3029 where we can discuss your application requirements.
Suggested Items
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.