Indium Corporation to Feature Innovative New Alloy at IPC APEX Expo 2020


Reading time ( words)

Indium Corporation will feature its new high-performance, high-reliability alloy technology at IPC APEX Expo, February 4-6, in San Diego, Calif., USA.

Durafuse LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications with reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performs better than SAC305 with optimum process setup. Durafuse LT:

  • Provides a solution for heat-sensitive components and flex polymers
  • Prevents thermal warpage of processor components and multilayer boards
  • Meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications.

To learn more about Indium Corporation’s innovative low-temperature technology, stop by the company’s booth at APEX (#1037), or reach out to our Technical Support Engineers at askus@indium.com. 

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

Share

Print


Suggested Items

June Issue of SMT007: A Snapshot of a Resilient Industry

06/30/2020 | Tamara Jovanovic, Happiest Baby
Tamara Jovanovic, an electrical engineer at Happiest Baby in Los Angeles, never imagined that I would have to take half of my lab equipment home to be able to continue doing her job. As she says in her review of the June issue of SMT007 Magazine, the entire industry is adapting to the "new normal," and ready for whatever the future brings.

IPC’s Shawn Dubravac: COVID-19 Outbreak Accelerates Industry Shifts Already Under Way

05/21/2020 | Barry Matties, I-Connect007
On May 19, Barry Matties spoke with Shawn Dubravac, chief economist for IPC. While discussing other topics, Matties asked for Dubravac’s perspective on shifts in the market, who observed that the recessionary trend might be behind us; the markets are already showing recovery. Still, it could take a year or so to fully recover.

Happy’s Smart Factory Protocol Primer

04/29/2020 | Happy Holden, I-Connect007
The smart factory concept is built upon data interchange as the foundation. There has been much development in the area of industrial and manufacturing data protocols over the years, stretching back into the 1960s. This article by Happy Holden surveys what are considered the most common protocols in use in the electronics manufacturing industry today, including IPC-CFX/ Hermes, OML, SECS/GEM, and MAPS.



Copyright © 2020 I-Connect007. All rights reserved.