Nortech Systems Finds a Creative Solution with CheckSum Software


Reading time ( words)

CheckSum, a leading provider of test systems, fixtures and programs, is pleased to announce that Nortech implemented its existing software environment for an end of line test (overmolding) with CheckSum’s user-friendly interface. Nortech already had a CheckSum in-circuit test fixture and program, and could send serial commands to control the functionality of the board since the software allows running external .exes. Nortech also had the ability to perform any software updates to the test units before the overmolding application.

Other benefits of using the CheckSum software for the Nortech team included; familiarity and ease of use for operators, ability to link external s/w like Python, built-in data-logging and SPC reporting, user logins and ease of editing programs.

Brandon, Senior Electrical Engineer at Nortech, said: “It was a simple task to strip down the spec file we had at the board level test to make something super quick for this new tester at the point of overmolding. Plus, it’s a medical product, so we want to have test reports and that capability already existed in our Checksum software.”

Nortech has been a Checksum customer for more than 15 years, offering world-class electronics manufacturing services — from early-stage product development and engineering through production and fulfillment. For more information about Nortech, visit www.nortechsys.com.

Share

Print


Suggested Items

The Long Road to a New Standard

09/17/2019 | Barry Matties, I-Connect007
Graham Naisbitt, chairman and CEO of Gen3 Systems, has spent decades leading cleanliness testing standards in a number of different standards organizations like IPC, IEC, and ISO around an assortment of testing methods, such as CAF, SIR, and even introducing a new standard this year for his own testing method—process ionic contamination testing (PICT). Naisbitt breaks down his long involvement with standards and where they stand currently.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.



Copyright © 2020 I-Connect007. All rights reserved.