Nordson DAGE Launches Prospector Micro Materials Tester


Reading time ( words)

Nordson DAGE, a division of the Nordson Corporation, has launched a new Prospector Micro Materials Tester. The flagship system has the most advanced mechanical testing technology in the DAGE product line, giving it new levels of test flexibility. Its capabilities cover the widest range of test scenarios for micro-components and devices.

Developed by Nordson DAGE’s in-house R&D team, Prospector enables the full characterization of any device by combining mechanical testing with four other complementary test months—electrical, thermal, acoustic and optical. These unique combinations give researchers and new product development engineers the ability to test across a wide range of micro applications including coatings and thin films, medical devices, micro-electronics, composites, plastics and fibres.

As quality expectations grow and components continue to get smaller, new product development researchers must be equipped with the most advanced test technology. Prospector allows operators to gain unique failure mode insights by using just one dedicated machine. This is made possible by the introduction of a range of new applications, including hardness and scratch testing. Prospector is built on the strong heritage of accurate testing Nordson DAGE developed for the bondtesting industry. It is even capable of using the same test modules from other DAGE bondtesters. For customers with multiple bondtesters in their production line, Prospector is the perfect partner for pre-production R&D colleagues and is a cost-effective method of improving the efficiency of their new product introduction testing.

Prospector uses a new generation of Paragon materials analytical software to control every aspect of the test allowing operators to perform a wide range of test types with minimal training.

Dr. Conor McCarthy, Product Manager for Bond Test and Materials Test, said, “After years of receiving strong feedback from our customers that they need more flexibility, we decided to build a dedicated micro-tester. On top of that, we have tried to exceed their expectations by adding unique features such as acoustic and thermal testing capabilities. It is an exciting time for Nordson DAGE, and we are looking forward to engaging with our customers to build on the already positive feedback.”

About Nordson DAGE
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award-winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.

About Nordson Corporation
Nordson Corporation is one of the world’s leading producers of precision dispensing equipment that applies adhesives, sealants, coatings and other materials to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has direct operations and sales support offices in more than 30 countries.

 

Share

Print


Suggested Items

The Long Road to a New Standard

09/17/2019 | Barry Matties, I-Connect007
Graham Naisbitt, chairman and CEO of Gen3 Systems, has spent decades leading cleanliness testing standards in a number of different standards organizations like IPC, IEC, and ISO around an assortment of testing methods, such as CAF, SIR, and even introducing a new standard this year for his own testing method—process ionic contamination testing (PICT). Naisbitt breaks down his long involvement with standards and where they stand currently.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.



Copyright © 2020 I-Connect007. All rights reserved.