TopLine to Exhibit at Internepcon Japan January 15-17 2020


Reading time ( words)

TopLine will exhibit its innovative CCGA technology and daisy chain component solutions at Internepcon Japan from 15-17 January 2020 at the Tokyo Big Sight venue. Internepcon Japan is one of seven shows comprising NEPCON JAPAN 2020,  the 34th Electronics R&D, Manufacturing and Packaging Technology Expo. TopLine will exhibit in Booth S4 – 17.

TopLine’s CCGA column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, and a quick chart of TopLine CCGA products, visit www.topline.tv/CCGA.html. For more information about CCGA, visit www.CCGA.co.

In addition to CCGA solutions, TopLine also manufactures daisy chain test components, Zero Ohm PCB jumpers and engineering evaluation kits for experimentation. TopLine also makes vibration dampers to extend the life of PCB assemblies. These and other TopLine innovations will be on exhibit in the show booth. For more information about the show, visit www.nepconjapan.jp/en-gb/about/exhibits/internepcon-japan.html.

About TopLine

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.

 

Share

Print


Suggested Items

MTV Offers Solder Paste Testing Solution

06/17/2020 | Nolan Johnson, I-Connect007
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.



Copyright © 2020 I-Connect007. All rights reserved.