Octavo Systems to Offer Hardware Design Review Service


Reading time ( words)

Octavo Systems, the leader in system-in-package (SiP) technology, has launched a Hardware Design Review Consulting Service for customers leveraging their SiP technology in their designs.

"Companies spend tens of thousands of dollars doing multiple spins of their design to remove bugs and errors that are found only after the board is manufactured," says Greg Sheridan, VP of Strategy for Octavo Systems. "This service is designed to help customers identify these potential issues before the boards are released, saving them money and getting them into production faster."

As part of the Hardware Design Review service, the submitted schematics and/or PCB layouts will be reviewed by at least two of Octavo Systems' system design engineers. They will review the entire design looking for issues around the use of the system-in-package as well as the other components in the system. At the end of the review the engineering team will provide customers with a detailed report of their findings on the entire design, not just the Octavo device.

"Our team of highly experienced system design engineers have been providing this service to a select group of customers for years, uncovering issues from power management and pin configurations to high speed routing of USB and Ethernet," Erik Welsh, Octavo's CTO added. "We are excited to make it available to any customer using an Octavo system-in-package."

Based on customer needs, the review can be completed in as few as two business days (seven business days is standard). Beyond the actual review the service also consists of a thirty-minute pre-call to go over the customer's design goals, a sixty-minute post-call to go over the findings of the report, and a detailed report that includes all the findings and recommendations.

Sheridan added, "At Octavo Systems, we strive to make designing electronic systems as easy as possible. We also pride ourselves on helping our customers turn their vision quickly into reality. This service offering builds on these principles, giving customers access to another set of skilled resources to help them reach their goals."

This Hardware Design Review Consulting Service adds to Octavo's extensive support of the Texas Instruments AM335x and STMicroelectronics STM32MP1 based SiP offerings. Octavo provides a host of free support options such as Opensource software and Hardware designs, Active Forums, Application Notes, Tutorials, Schematic and layout Check Lists, and FAQs. Octavo also offers several Opensource development kits to enable customers to quickly evaluate the platform and begin prototyping.

About Octavo Systems

Octavo Systems, LLC is the leader is System in Package (SiP) technology. It has microprocessor based SiP devices based on the Texas Instruments AM335x and ST Micro's STM32MP1 processors. Each of the SiP devices integrates with the processor its power management and RAM. The Ball Grid Array has been carefully mapped to increase the ease of laying out Printed Circuit Boards, allowing fewer interconnect layers along with smaller size. Octavo was organized in 2015 and has been in production with SiP devices for three years. The SiP devices are found in many commercial and industrial applications.  Octavo Systems is an ISO9001 certified company.  For more information visit: octavosystems.com.

 

Share

Print


Suggested Items

Part 11 of Siemens’ Digital Twin Webinar Series: Data-Driven Manufacturing

11/18/2020 | I-Connect007 Editorial Team
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 11, Gorajia discusses, “Data-Driven Manufacturing: Making Big Data Into Smart Data.”

Part 10 of Siemens’ Digital Twin Webinar Series: Inventory Management

11/11/2020 | I-Connect007 Editorial Team
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 10, Gorajia looks at “Inventory Management in the Warehouse and on the Shop Floor.” Material accounts for 80% of PCB assembly costs. If not managed correctly, margins can be cut even further.

Part 9 of Siemens’ Digital Twin Webinar Series: Intelligent Data Acquisition and Normalization

11/04/2020 | I-Connect007 Editorial Team
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 9, Gorajia’s topic is “Intelligent Data Acquisition and Normalization.” He asks, “With the considerable investment in automation of the PCB assembly process, why is it a challenge to get data from the production line?”



Copyright © 2020 I-Connect007. All rights reserved.