Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation


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The latest book in I-Connect007’s The Printed Circuit Assembler’s Guide to… series is authored by Gen3’s Graham Naisbitt. With his deep background in process validation and standards work, Naisbitt is uniquely qualified to explore achieving acceptable electrochemical reliability using both CAF and SIR testing. This eBook is a perfect present for the holidays.

Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, it stands to reason that electronic circuit boards are now deployed into humid and potentially corrosive environments to a greater extent than ever before. In these harsh environments, electronics are at greater risk of electrochemical migration (ECM) failure.

Naisbitt begins The Printed Circuit Assembler’s Guide to… Process Validation with an outline of the history of contamination testing. The book’s two main technical sections then explore SIR and CAF test models for insulation resistance testing, and how to achieve Six Sigma with ionic contamination process controls.

According to peer reviewer Dr. Lothar Henneken, senior expert and six sigma blackbelt, automotive electronics at Robert Bosch GmbH, “This book is an excellent reflection of the current state of experts' views on the subject. Recent changes in IPC and IEC documents are explained in an understandable way. Many misinterpretations and emotional views, especially on ionic contamination measurement, are cleared up in a simple manner.”

Mike Cummings, a technical director at TSI, adds, “Well-written and easy to follow, this dedicated book focuses on the importance of cleaning and decontamination of electronic circuits before application. This topic is timely and important.”

The Printed Circuit Assembler’s Guide to…Process Validation is a must-read for those in the industry who are concerned about ECM and want to adopt a better and more rigorous approach to ensuring electrochemical reliability.

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