CyberOptics Sensors: So Good That Their Rivals Use Them


Reading time ( words)

During productronica 2019 in Munich, Germany, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.

In this video interview, part of the productronica 2019 coverage, the I-Connect007 team speaks with Subodh Kulkarni, president and CEO of CyberOptics, a company that makes sensors for the electronics manufacturing and semiconductor industries.

Editor Nolan Johnson and Subodh discuss CyberOptics’ latest precision 3D systems, such as the SQ3000, which offers AOI, SPI and CMM functionalities. The inline CMM system includes top-of-the-line software for metrology grade measurements of critical points. Subodh points out that some of his competitors even utilize CyberOptics sensors in their equipment.

The productronica event is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.

Watch video below:

Share

Print


Suggested Items

Real Time with… SMTAI 2020: Technical Conference Review

10/06/2020 | Real Time with...SMTAI
SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.

What Is Digital Twin Technology, and Why Is It So Important?

09/09/2020 | Happy Holden, I-Connect007
Happy Holden describes how Siemens' 12-part webinar series, “Implementing Digital Twin Best Practices From Design Through Manufacturing,” is an excellent series designed to educate the electronic manufacturing engineer on the progress of using a digital thread to improve products and performance.

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.



Copyright © 2020 I-Connect007. All rights reserved.