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Test Research, Inc. (TRI) will join IPC APEX EXPO 2020 held at San Diego Convention Center to showcase its Smart Factory inspection and test solutions for the printed circuit board electronics manufacturing industry. Visit TRI at booth #1151 on February 4 – February 6, 2020, to discover the newest innovations in 3D SPI, 3D AOI, 3D CT AXI, and multicore ICT.
TRI’s 2020 lineup features the industry’s leading 3D SPI TR7007QI, for accurate shadow-free solder inspection with digital fringe projectors and smart board warpage control.
TRI will exhibit the newly released High Accuracy Inspection with High Gauge R&R 3D AOI TR7700Q SII. Test Research, Inc. is introducing the new TR7600F3D SII 3D AXI with next-generation mechanical design for higher speed up to 10 FOV/s. Also being showcased is the TR7700QE-S 3D AOI, designed for the Semiconductor & Packaging Industry, with ultra-high resolution at 5.5 μm.
Test Research, Inc. will also showcase a demo of the newly developed AI-powered Smart Factory solution. TRI will additionally present the Shadow-free 3D SPI TR7007QI, the world-class high-speed 3D AXI TR7600 SIII for multiple industry applications and the Multi-core TR5001 SII LED INLINE ICT.
Visit us at IPC APEX EXPO 2020 booth #1151 for a personal demonstration of TRI's industry-leading world-class test and inspection solutions lineup.