TRI to Feature New Test and Inspection Solutions at IPC APEX EXPO 2020


Reading time ( words)

Test Research, Inc. (TRI) will join IPC APEX EXPO 2020 held at San Diego Convention Center to showcase its Smart Factory inspection and test solutions for the printed circuit board electronics manufacturing industry. Visit TRI at booth #1151 on February 4 – February 6, 2020, to discover the newest innovations in 3D SPI, 3D AOI, 3D CT AXI, and multicore ICT.

TRI’s 2020 lineup features the industry’s leading 3D SPI TR7007QI, for accurate shadow-free solder inspection with digital fringe projectors and smart board warpage control.

TRI will exhibit the newly released High Accuracy Inspection with High Gauge R&R 3D AOI TR7700Q SII. Test Research, Inc. is introducing the new TR7600F3D SII 3D AXI with next-generation mechanical design for higher speed up to 10 FOV/s. Also being showcased is the TR7700QE-S 3D AOI, designed for the Semiconductor & Packaging Industry, with ultra-high resolution at 5.5 μm.

Test Research, Inc. will also showcase a demo of the newly developed AI-powered Smart Factory solution. TRI will additionally present the Shadow-free 3D SPI TR7007QI, the world-class high-speed 3D AXI TR7600 SIII for multiple industry applications and the Multi-core TR5001 SII LED INLINE ICT.

Visit us at IPC APEX EXPO 2020 booth #1151 for a personal demonstration of TRI's industry-leading world-class test and inspection solutions lineup.

Share

Print


Suggested Items

This Month in SMT007 Magazine—Electronics Manufacturing: A Critical Industry and Supply Chain

07/01/2020 | I-Connect007 Editorial Team
Chris Peters represents the U.S. Partnership for Assured Electronics, where he advocates for electronics manufacturing as a critical industry. Here, he describes the current status, the supply chain, and what he sees in Washington D.C.

June Issue of SMT007: A Snapshot of a Resilient Industry

06/30/2020 | Tamara Jovanovic, Happiest Baby
Tamara Jovanovic, an electrical engineer at Happiest Baby in Los Angeles, never imagined that I would have to take half of my lab equipment home to be able to continue doing her job. As she says in her review of the June issue of SMT007 Magazine, the entire industry is adapting to the "new normal," and ready for whatever the future brings.

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.



Copyright © 2020 I-Connect007. All rights reserved.