Clean vs. No-clean: A Generational Difference


Reading time ( words)

Tom Forsythe, executive VP of KYZEN, discusses what readers should know about cleaning as reliability expectations continue to increase. He also explains what is driving the new interest in cleaning and why engineers from the no-clean generation may not even realize they need to learn more about cleaning.

Barry Matties: Tom, why don’t you start by telling us about your new generation of stencil and misprinted board cleaner.

Tom Forsythe: Absolutely. KYZEN E5631 has been under development for some time. The whole challenge for us, of course, is that contaminants, fluxes, and pastes are constantly evolving. Many leading solder makers around the world are trying to improve their performance because our mutual customers are demanding improved performance from them. It trickles down to the cleaning folks to make sure we can remove those residues, whether it’s uncured adhesives, uncured paste in a true stencil printing application, or anything down that road. That’s the key, and it’s an area that we’ve done a lot of research on over the last 5–10 years. It had been stagnant for a long time, but once you crack the egg and start working around, your development leads you in lots of different directions; that’s how 5631 came to be.

Matties: Is this driven by the finer features that are appearing?

Forsythe: The finer features drive back to the stencils. The companies making the stencils have issues because they have to make apertures that are smaller and closer together and more well-defined. As those apertures get smaller, then it becomes a bit more difficult to get things out of those smaller apertures and have flow go through them. It all cascades. But it fundamentally comes down to the materials. The bigger driver on the stencil side is the new materials. Remember, when you reflow paste, lots of volatiles come off. It goes through a state change and creates that hard encapsulant.

To read this entire interview, which appeared in the December 2019 issue of SMT007 Magazine, click here.

Share




Suggested Items

Real Time with … IPC APEX EXPO 2023: Mycronic Extends Reach

01/11/2023 | Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.

Five-Star Reflow Recipes: Q&A With Rob Rowland

12/28/2022 | Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”

Essemtec: Manufacturing Moves In-house

12/28/2022 | Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.