-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha Electronic Solutions to Present at SMTA Capital Chapter Meeting
January 8, 2020 | SMTAEstimated reading time: 2 minutes
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
This presentation will explore topics relating to lead-free alloy development, enhancements in solder paste performance, and processing differences between these alloys and typical SAC and tin-lead alloys.
In the age of environmental regulations that have driven the electronics industry to widely adopt tin-silver-copper (SAC) lead-free solders, high reliability applications continue to use legacy tin-lead solder alloys. However, evolving designs, service environments, and reliability requirements have driven development of new types of solder alloys. In addition, shrinking package sizes requiring increased power densities have created the need for high electrical reliability and low voiding from solder paste fluxes.
Jason Fullerton has been with MacDermid Alpha Electronics Solutions as a Customer Technical Support Engineer since 2013. He earned his Bachelor's Degree in Manufacturing Engineering from GMI Engineering & Management Institute (now Kettering University) in Flint, MI. He has worked in manufacturing operations in the automotive, high-reliability, and commercial electronics industries since 1993, specializing in SMT and Wave Soldering process engineering. Jason is a member of the SMTA and served as an officer in the Philadelphia chapter from 2011 - 2014. He is also an ASQ Certified Quality Engineer, Six Sigma Black Belt, and Reliability Engineer.
Jason has published and presented at a number of SMTA and IPC meetings and is recognized by the SMTA as a “Distinguished Speaker.” He is a participating member of the IPC J-STD-001 Task Group and received a Distinguished Committee Service Award for work related to development of changes to the ionic cleanliness requirements in J-STD-001G.
Don’t miss out on dinner and a facility tour prior to the presentation. Registration is $20 for members and $30 for non-members. Registration fee will be waived if you join the Capital Chapter during this event!
The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation
The SMTA Capital Chapter Meeting Location:
PACE Worldwide
6605 Selnick Dr. #C
Elkridge, MD 21075
About SMTA: 30 Years Developing Solutions in Electronics Assembly
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please visit www.smta.org.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.