MIRTEC Achieves Most Successful Year in Company History


Reading time ( words)

MIRTEC Co. LTD, a leading global supplier of automated optical inspection systems to the Electronics Manufacturing Industry, reports record sales revenue in 2019 for its North American Sales and Service Division. “Not only has 2019 been the most successful year in our corporate history,” stated Brian D’Amico, President of MIRTEC Corp, “it represents the ninth consecutive year of record sales revenue for our division. This is quite an accomplishment and an overwhelming testament to the integrity of our products and that of our personnel. It is truly a pleasure to work with such an outstanding team of engineering, sales and support professionals.”

D’Amico, attributes this impressive growth to record demand for MIRTEC’s MV-6 OMNI In-Line 3D AOI system and MV-3 OMNI Desktop 3D AOI system. Customer demand for these two award winning platforms as well as the equally impressive MS-11e 3D SPI system continues to fuel MIRTEC’s expansion within the highly competitive SMT inspection market.

The MV-6 OMNI combines MIRTEC’s exclusive 15 Mega Pixel CoaXPress Camera technology with their proprietary OMNI-VISION® 3D Digital Tri-Frequency Moiré technology to provide precision inspection of SMT devices on finished PCB assemblies.  

The award winning MV-3 OMNI Desktop 3D AOI system is configured with the same hardware and software as MIRTEC’s in-line OMNI-VISION® 3D Inspection Systems providing 100% compatibility across MIRTEC’s entire 3D AOI product line. Without question, the MV-3 OMNI is the most technologically advanced Desktop 3D AOI machine in the world!

MIRTEC’s award winning MS-11E 3D SPI machine is also configured with an exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

“MIRTEC continues to set new standards within the highly competitive Electronics Inspection industry,” continued D’Amico. “These revolutionary products provide unprecedented 3D inspection performance and the industry’s lowest cost of ownership making them an ideal solution for electronics manufacturing companies of all sizes.

“On behalf of all of us at MIRTEC I want to thank our valued customers for your business confidence and your support. It has been a pleasure helping you reach your production quality objectives. We look forward to contributing to your success in 2020 and beyond!”

About MIRTEC

MIRTEC is a leading global supplier of Automated Optical Inspection Systems to the Electronics Manufacturing Industry. For more information, please contact MIRTEC directly. Phone: 203-881-5559 • Fax: 203-881-3322 • Web: www.mirtec.com.

Share

Print


Suggested Items

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.



Copyright © 2020 I-Connect007. All rights reserved.