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Intermetallic compounds (IMCs) play an increasingly critical role in the performance and reliability of solder interconnections in the chip level, package level and board level of lead-free electronics.
Dr. Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge to address “Reliability of Electronics - the Role of Intermetallic Compounds” on Monday, February 3, from 9:00 to 12:00 p.m. in the professional development course (PD13) at IPC APEX to be held at the San Diego Conference Center.
PD13: “Reliability of Electronics - the Role of Intermetallic Compounds”
With the goal to produce reliable products while achieving high yield production, this course focuses on one of likely product failure processes that are induced or aggravated by time, temperature and/or stress - intermetallic compounds.
This course covers the relevant and important aspects of intermetallic compounds ranging from scientific fundamentals to practical application scenarios. Intermetallic compounds before solder joint formation, during solder joint formation and after solder joint formation in storage and during service will be examined. Intermetallics at-interface and in-bulk, as well as the role of PCB surface finish/component coating in relation to intermetallics, in turn, to the reliability, will be discussed. The difference between SnPb and Pb-free solder joint in terms of intermetallic compounds, which affects production-floor phenomena and the actual field failure, will be outlined. The course will also address the relevant aspects of “newer” Pb-free alloys that were recently introduced to the market. The course emphasizes practical, working knowledge, yet balanced and substantiated by science. Attendees are welcome to bring their own selected systems for deliberation.
Please join your industry colleagues in this course.
• Intermetallic compounds " definition, fundamentals, characteristics
• Phase diagrams of Pb-free solders in contrast with SnPb
• Intermetallic compounds in the intrinsic material- Pb-free vs. SnPb
• Formation and growth during the production process and during the product service life
• Intermetallic compounds - at-interface vs. in-bulk
• Effects from substrate compositions (hybrid module thick film pads, PCB surface finish, component surface coating)
• Gold embrittlement
• Different types of intermetallic compounds " effects on solder joint reliability (Ni/Au, Ni/Pd/Au, Ni/Pd, Cu)
• SAC alloys incorporated with various doping elements " characteristics, performance
• “Low-Temperature” solder alloys " critical areas to product reliability
• Effects on failure mode
• Effects on reliability.
Who should attend? The course provides working knowledge and pragmatic perspectives to all who are concerned about the reliability or interested in understanding the solder joint behavior in relation to intermetallic compounds, including designers, researchers, managers, quality, manufacturing and reliability professionals.
About Dr. Jennie S. Hwang
Dr. Jennie S. Hwang—an international businesswoman and speaker, and business and technology advisor—is a pioneer and long-standing contributor to electronics hardware manufacturing as well as to the environment-friendly lead-free electronics implementation. Among her many awards and honors, she was inducted to the International Hall of Fame—Women in Technology, elected to the National Academy of Engineering, an R&D-Stars-to-Watch, and YWCA Achievement Award. Having held senior executive positions with Lockheed Martin Corp., Sherwin Williams Co., SCM Corp, and CEO of International Electronic Materials Corp., she is currently CEO of H-Technologies Group providing business, technology, and manufacturing solutions. She is the Chairman of the Assessment Board of the DoD Army Research Laboratory, serving on Commerce Department’s Export Council, National Materials and Manufacturing Board, NIST Assessment Board, Army Science and Technology Board, various national panels/committees, international leadership positions, and the board of Fortune-500 NYSE companies and civic and university boards. She is the author of 500+ publications and several books, and a speaker and author on trade, business, education, and social issues. Her formal education includes four academic degrees as well as the Harvard Business School Executive Program and Columbia University Corporate Governance Program.