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Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry is pleased to announce a faster, more efficient, and error-proof Portable Operator Interface: the new TTC GO!
As part of Cogiscan's ongoing commitment to our industry-leading suite of Material Control and other TTC Applications, we are proud to show TTC Go! for the first time in America at APEX 2020. This new application is a major upgrade to the already widely used Portable Operator Interface. Operators require simple and intuitive tools to run production. This new application is completely redesigned to take full advantage of Android 7+ supported mobile devices.
The new TTC GO! Is Modern, Intuitive & Simple:
• Simplify production tasks with a modern and user-friendly handheld interface with intuitive navigation features
• Leverage flexibility by downloading the free app on any Android supported device
• Upgrade outdated technology that will no longer be
supported by PDA vendors
• Save hardware costs by utilizing modern, reliable, and less
expensive devices that can be easily upgraded
“With the introduction of TTC GO, we break a paradigm in how manufacturing software user interfaces are designed. The context driven interface is very intuitive and easy to use as it guides the user to achieve simple tasks with as little clicks, data entry or scanning steps as possible.” Stated André Corriveau, CTO at Cogiscan. “Built on state-of-the-art technologies, it runs over Windows and Android platforms, including smart phones.”
Cogiscan POI users can download & upgrade for FREE with a valid service contract. Come see the new TTC GO! At IPC APEX EXPO, Booth #1737, February 4 to 6, 2020.
06/16/2015 | Tom Adams, Sonoscan Inc.
Plastic packaged ICs, including BGAs, may experience warping as a result of processing. This article talks about using acoustic micro-imaging tools to measure and map the flatness of the top surface of a BGA package where warping may occur.
04/07/2015 | Indium Corporation
Tim Jensen and Dave Saums write about the critical role of the thermal interface material in improving the efficiency of heat transfer between a semiconductor device and the surface to which it is attached.