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Indium Corporation’s Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held March 1-4, 2020 in Mesa, Arizona, USA.
Berntson will be presenting on Monday, March 2 at 9 a.m.
Demands for entertainment connectivity, edge computing, energy efficiency, speed, convenience, safety, and much more are driving changes in electronic architecture, especially advanced packaging. In his presentation entitled Materials Science Innovation in Advanced Packaging, Berntson will examine the advances in materials technologies, with an emphasis on the interconnect systems and thermal management necessary to support these new packages. Performance, processing challenges, and total cost will be discussed for each material, and Berntson will also share some of the roadmap gaps that need to be addressed with new materials and possible solutions.
Ross Berntson is President and Chief Operating Officer for Indium Corporation. He is responsible for Indium Corporation’s global sales, marketing, technical support, operations, engineering, human resources, and product R&D functions.
Berntson joined Indium Corporation in 1996 as a Product Specialist. He quickly rose to the roles of Product Manager, Marketing Leader, Sales Leader, and Tech Support Leader. Most recently, he has served as Executive Vice President and President of Indium Corporation’s Asia Holdings. Berntson lived in Singapore for two years, learning much about the daily activities in Southeast Asia and China. While there, he expanded his understanding of the regional business needs and opportunities for our company.
Berntson has been instrumental in forging new marketing strategies and providing expanded sales opportunities for Indium Corporation’s full line of solder products. He is an active member of numerous industry organizations, including the IPC, iNEMI, IMAPS, and SMTA. He has published several technical papers and articles, and presented at technical conferences globally. Berntson has a master’s degree in Business Administration and a bachelor’s degree in Chemistry from Cornell University, where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.