MacDermid Alpha Electronics Solutions to Highlight the Kester Integration at IPC APEX EXPO 2020


Reading time ( words)

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature Affinity 2.0, their highly stable, low corrosion ENIG process and the ALPHA® HiTech™ portfolio of low temperature adhesives, encapsulants, and underfills, at the IPC APEX Conference and Expo, February 1-6, in San Diego, California.

Advanced technologies often bring increased complexity, but well-designed technologies bring performance and simplicity. The Affinity 2.0 process’ highly stable activation and nickel plating allows for an ultra-uniform gold deposition with exceptional control. The Circuitry Solutions division will also highlight their complete line of leading-edge copper filled microvia and electroless copper processes.

A recent addition to the Assembly Solutions division, the ALPHA HiTech series of low temperature adhesives, encapsulants, and underfills is a one-stop bonding platform designed to reduce the scale-up risk for component assemblies deployed into demanding applications.  ALPHA HiTech materials exhibit superior drop-shock, impact bend and thermal cycle performance.  Their wide processing range has proved to be beneficial for assemblies, especially those incorporating temperature sensitive components. The ALPHA HiTech suite of products has broad application potential for Automotive, Medical, Smartphone, and White Goods assemblies.

This year, MacDermid Alpha Electronics Solutions is proud to welcome Kester to its electronics business. The acquisition of Kester reflects the strategic goals of MacDermid Alpha to expand its expertise and offerings throughout the electronics manufacturing supply chain.  “The addition of Kester’s talent and expertise will be an important asset in achieving our goal of providing customers with leading products and solutions to ensure highest reliability and performance,” said Tim Williams, Vice President of the MacDermid Alpha Assembly Solutions division.

The Kester team will showcase their innovative assembly products, including 268 Flux-Cored Wire, high reliability products: NP505-HR Solder Paste, 275 Flux-Cored Wire, Select-10 Selective Soldering Flux, NF372-TB Soldering Flux and RF550, and solder pastes: NP560, WP616, NP545 and NP505-LT.

For additional information about MacDermid Alpha’s latest technologies and products, please visit Booth #1824 at IPC APEX, or contact us @ info@macdermidalpha.com

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

Share




Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.



Copyright © 2022 I-Connect007. All rights reserved.