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Foxconn Technology Group and Heraeus, two leading global technology groups, signed a Memorandum of Understanding for a strategic cooperation. Both companies are committed to shaping the future of 5G technology together.
Foxconn and Heraeus aim to jointly develop new market potential in the field of 5G telecommunications and collaborate to test solutions in order to accelerate the development process. A first area of cooperation will be the shielding of electromagnetic interference (EMI)—a key technology for 5G mobile phones.
“Foxconn and Heraeus share the same vision of bettering people’s lives with advancement and application of technologies,” said Max Chu, Chief Procurement Officer at Foxconn. “We aim to leverage each company’s expertise, innovative ability and constant striving for improvement.”
“With 5G technology we are entering a new era of connectivity,” said Frank Stietz, President of Business Area Electronics at Heraeus. “Strong partnerships like this will help us to jointly develop innovative solutions needed by manufacturers in the upcoming years.”
Prior to the signing of the Memorandum of Understanding, Foxconn and Heraeus have cooperated in jointly exhibiting selected technologies at China International Import Exhibition (CIIE) in Shanghai, China this year.
Barry Matties, I-Connect007
JB Byers, vice president of technical support services at A-Tek Systems in Longmont, Colorado, recently gave a presentation on vapor phase reflow soldering at the SMTA Boise Expo & Tech Forum. After his presentation, I-Connect007 briefly talked with him about how the process can help reduce voids and lower operating cost.
Andy Shaughnessy, I-Connect007
At the recent SMTA Dallas Expo & Tech Forum, I spoke with Fernando Rueda, manager of the Americas for KYZEN, about the company’s newest technologies and trends he’s seeing in SMT cleaning processes. As Fernando points out, cleaning is now a requirement for most boards, and the cleaning process becomes more challenging as features get smaller and faster. No-clean technology can often make a challenging situation worse.
Happy Holden, I-Connect007
We were back in San Diego, maybe for a “long vacation,” as IPC APEX EXPO is in Anaheim next year. Before we get to Anaheim, though, let’s talk about the show: It was a great week. I spent Sunday and Monday visiting some excellent Professional Development courses. As you know, this is a fast-changing industry, and we have to keep learning to stay ahead. On Monday, I attended the Microvia Weak Interface/Reliability subcommittee, and on Tuesday, the Ultra-HDI Technology Committee.