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Indium Corporation will feature its precision AuSn preforms for die-attach applications at SPIE Photonics West, Feb. 1-6, in San Francisco, Calif., USA.
Indium Corporation’s AuLTRA™ ThInFORMS™ are a 0.00035” (0.00889mm) thin 80Au20Sn preform for die-attach applications. They reduce solder volume, solder wicking, and voiding thereby improving thermal transfer and the overall operational efficiency of the package.
For more information about Indium Corporation’s precision gold products, see our experts at the show at booth #4584 or visit www.indium.com/gold.