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Watch Coatings Uncoated Webinar, Part 6 Now: Field Failures, Silicon vs. Sulfur
February 19, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The sixth episode of the popular webinar series, Coatings Uncoated, is now available to view. Based on an interesting case study concerning a telecommunications giant experiencing a high degree of field failures, coatings specialist Phil Kinner explains the mechanism behind the failures and why the silicone option proved unsuccessful. Part six of this micro webinar series concludes with a full explanation of the successful solution.
Author of The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
Watch the latest segment, “Circuit Failures Case Study: Silicone vs. Sulfur,” in under five minutes!
In this engaging, 12-part webinar series, Kinner delves even deeper into the subject, examining conformal coating chemistries in further detail, including their properties, applications, issues to be mindful of, and the processes you should follow to achieve a successful coating outcome. The entire “Coatings Uncoated!” webinar series can be viewed in an hour and covers a comprehensive range of hot topics and application-relevant case-study overviews, as well as back-to-basic subject matter and issues, such as condensation and contamination. Most of the 12 segments can be viewed in five minutes or less.
Got five minutes? Visit http://iconnect007.com/webinar/cu/.
Suggested Items
Happy’s Tech Talk #26: Balancing the Density Equation
03/14/2024 | Happy Holden -- Column: Happy’s Tech TalkPrinted circuit design and layout is a creative process that has profound implications for electronic products. With the need for more parts on an assembly, or the trend to make things smaller to be portable or for faster speeds, the design process is a challenging one. The process is one of “balancing the density equation” (Figure 1) with considerations for certain boundary conditions like electrical and thermal performance. Unfortunately, many designers do not realize that there is a mathematical process to the layout of a printed circuit
A Brief History of IPC APEX EXPO
03/13/2024 | Alicia Balonek, IPCIn 1998, the Surface Mount Equipment Manufacturers Association (SMEMA) approached IPC for help. Because of IPC’s success with the Printed Circuits Expo and recognizing the need to establish control of its own event, the discussions between SMEMA and IPC ensued. This led to a merger between the two organizations and provided SMEMA with IPC member benefits.
FTG Circuits Earns IPC-1791 Trusted Electronic Designer, Fabricator and Assembler QML Requalification
03/11/2024 | IPCIPC’s Validation Services program has awarded an IPC-1791, Trusted Electronics Fabricator Qualified Manufacturer Listing (QML) requalification to FTG Circuits’ Haverhill, Mass. location.
Testing Todd: Why 4-wire Kelvin?
03/08/2024 | Todd Kolmodin -- Column: Testing ToddAs William Thomson (Lord Kelvin) once said, “If you cannot measure it, you cannot improve it.” This is truer today than ever before. With the advances in microelectronics and nanoelectronics, HDI, and buried active/passive components, the signature of the printed circuit is critical. High-speed substrates rely on signal transmission to be as pristine as possible. Minor changes can cause impedance changes in standing wave ratio (SWR) elevation, which leads to degraded performance.
Electronics Circuit World Convention: A Brief History
03/07/2024 | David Bergman, IPCIn 1978, a new event called the Printed Circuit World Convention (PCWC) was born. It brought together printed wiring board (PWB) associations from around the world to focus on advancing technology, growing the market, and providing insight into the management of the manufacture of printed boards.