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One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
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Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
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Have SPI and AOI but not RPI? Meet KiC at SMTA Chihuahua
February 26, 2020 | KIC ThermalEstimated reading time: Less than a minute
KIC announced that it will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, March 19, 2020 at the Villarreal Eventos in Chihuahua, CP. Miguel Carbajal, KIC’s Mexico Sales Manager, will discuss the company’s Smart Factory solutions that provide process control, traceability, automation, connectivity, data collection and analytics, and fast and easy integration for i4.0.
Have SPI and AOI but not RPI? Find out what you’re missing without Reflow Process Inspection. With RPI i4.0, and KIC’s NPI and process setup tools, all relevant data can connect to the factory MES or your factory data collection system to be easily analyzed and shared with personnel for clear factory analytics, optimization and corrective action.
Move toward the future of line connectivity, flexible production, machine learning and real-time insight. For more information about KIC, visit www.kicthermal.com.
Suggested Items
The Connection Between Wire Harness and Box Build
04/17/2024 | Nolan Johnson, I-Connect007Christina Rutherford is a technical lead and expert in materials engineering at Honeywell, where her specialty is the design, specification, and manufacture of cables and wire harnesses. Rutherford also sits on the committee for IPC/WHMA-A-620. In this conversation, we explore the changing dynamics in wire harnesses and how they relate to box build. Christina’s standards work allows her to draw insightful parallels between wire harness and box build.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Connect the Dots: Designing for Reality: Prioritizing Manufacturability
04/11/2024 | Matt Stevenson -- Column: Connect the DotsRealistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.
NetVia Group Acquires Direct Imaging from Mivatek
04/09/2024 | Miva TechnologiesMiva Technologies is pleased to announce NetVia Group, Irving, TX has acquired a new Miva 2400NG Dual Tray Direct Imaging System with 30-micron capabilities for inner, outer and soldermask imaging.