ASM’s Integrated Smart Factory Makes the Grade at IPC APEX EXPO 2020


Reading time ( words)

The recent IPC APEX EXPO electronics event saw leading smart factory innovator ASM Assembly Systems deliver on its promise of an integrated Industry 4.0-capable solution with connected technologies that span all elements of the factory floor and the global enterprise. Cohesive and open data communication at every level forms the backbone of efficient and effective workflows and, as shown on ASM’s booth, the company is among the first to deliver such as comprehensive solution.

From Concept to Reality

“Within a live factory floor simulation, ASM’s exhibit effectively brought the modern manufacturing operation to life for our visitors and customers,” shares Jeff Timms, ASM Senior Director and Regional Managing Director, Americas. “From personnel task prioritization with ASM Command Center to line-side material delivery via AIVs to ASM Academy online, on-demand and virtual reality training and maintenance, show delegates saw precisely how ASM can help automate complex and time-consuming processes for greater efficiency, quality, productivity and profitability.”

High-speed and flex lines at the center of the display illustrated the breadth of the ASM offer. Market-leading SIPLACE TX 96,000 cph, metric 0201-capable placement platforms, the new five-second cycle time DEK TQ stencil printer and AIV-enabled material delivery demonstrated closed-loop, zero-assist production of today’s most advanced assemblies. For operations that manage more product variation, the flex line with ASM ProcessExpert self-learning print optimization, DEK NeoHorizon 03iX printing platform, high-performance ASM ProcessLens 5D SPI and scalable side-by-side SIPLACE SX placement systems showcased seamless product changeover in a high-mix environment. Underscoring the importance of digitalization and data analysis in the factory of the future, the ASM production lines were bookended by an impressive control center and a hands-on virtual reality training experience.

Award-winning Products

ASM’s latest developments, the DEK TQ print platform and the SIPLACE AutoRefill Feeder, were also recognized with notable industry awards during the event. DEK TQ was the recipient of the competitive IPC APEX EXPO Innovation Award, bestowed by the IPC industry association and evaluated by a panel of judges that hail from top assembly OEMs and contractors. One of only six products selected for this honor, DEK TQ was chosen for its its innovation, manufacturing impact and value to the customer. Through a combination of off-belt printing and a unique clamping system, DEK TQ delivers accuracy of +/- 17.55 µm @ 2 CpK wet print (+/- 12.5 µm @ 2 CpK machine alignment) and ensures reliable printing processes with 0201 metric components. Equally impressive is the platform’s ability to run for eight continuous hours with no assists, thanks to the robust paste management and understencil cleaning systems.

Also acknowledged was ASM’s leadership in placement innovation, as the company’s new AutoRefill Feeder was declared the winner of a Circuits Assembly NPI Award. The AutoRefill Feeder helps eliminate hectic splicing processes and refill delay line stops. In conjuction with the active component reel, a second infeed can be used to equip another tape. If the first reel runs empty, the feeder automatically switches to the second tape reel. With this system, operators can refill reels proactively as time permitsand without any splicing. What’s more, offline setup processes are accelerated via an automatic infeed, the two reel per feeder preparation capability helps reduce refills on the line, and gapless traceability is ensured with automatic reel switch detection.

“Simply put, all of our customers want to maximize production volumes at the highest quality possible,” says Timms, noting that with the broad ASM offer is completely scalable for any size operationwhether small, mid-tier or high-volume. “There was something for everyone at ASM’s APEX exhibit and show delegate enthusiasm for our total solution was further validation of our development priorities.”

The SMT Solutions segment of ASM Pacific Technology

The mission of the SMT Solutions segment within the AMS Pacific Technology Group (ASMPT) is to implement and support the smart SMT factory at electronics manufacturers worldwide.

ASM solutions such as SIPLACE placement systems and DEK printing systems support the networking, automation and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the smart SMT factory in stages and enjoy dramatic improvements in productivity, flexibility and quality.

Since maintaining close relationships with customers and partners is a central component of ASM’s strategy, the company has established the SMT Smart Network as a global forum for the active exchange of information between and with smart champions. In addition to being a founding member of the ADAMOS joint venture for the development of an IIoT platform for manufacturing companies, ASM is establishing together with other SMT manufacturers the open HERMES standard as a successor to the SMEMA standard for M2M communication in SMT lines.

Share

Print


Suggested Items

Just Ask Eric: Nano-Coating on Stencils?

09/17/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes. Today's question involves the use of nano coatings on stencils.

Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields

09/16/2020 | Real Time with...SMTAI
KYZEN Executive Vice President Tom Forsythe shares company updates on stencil cleaning with Nolan Johnson. KYZEN recently announced its newest stencil cleaning product—KYZEN E5631. Forsythe details how the product is best used, as well as the benefits it brings to maximizing stencil life and improving manufacturing yields.

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

06/19/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.



Copyright © 2020 I-Connect007. All rights reserved.