JAVAD EMS Installs Robotic Soldering to Continued Push to Automate Manufacturing


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JAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, announces that it has installed a Hakko HU-200 Robotic Soldering System at its facility in Silicon Valley. An absolute encoder enables the machine to monitor the location of the soldering iron at all times, ensuring JEMS a high level of repeatability and automation.

The HU-200 is a 4-axis system with a large working envelope of 200mm x 300mm. The system offers a top speed of 800mm/s and boasts a repeatability of 0.01mm. The HU-200 utilizes the power of the Hakko FU-601 Robotic Integration Soldering Module but integrates the communication of the Hakko FU500 Feeder Controller directly into the robot.

Gary Walker, Vice President of JEMS stated: “We have continued to look into all ways to automate our processes to drive down costs and increase efficiency. One thought was to look at ways to automate hand soldering to help mitigate the pressure of the availability of skilled hand soldering personnel here in the Bay Area. The Hakko soldering robot is a solution to that issue. The key for us was to find something that is easy to program and operator friendly to use while at same time not compromising quality in any way. We have been able to more than meet those objectives and are currently using the system on numerous PCBAs for a variety of customers and applications with the expectation that more of these systems will be put into production in the near future.”

JEMS’ surface-mount-technology (SMT) lines are complete with inline three-dimensional (3D) solder paste inspection and AOI complimented by fully automated 3D X-ray for solder joint inspection. The company has more than 40,000 ft.2 of manufacturing space that it continually updates to the highest standards of electronic manufacturing services, communication, client support, employee comfort, and training.

JEMS’ manufacturing lines are highly flexible, allowing for diverse and complex products using the latest in component packaging technologies to be assembled and with quick changeover between products, enabling high-mix, low to medium volume production.

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