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Electronic components continue to miniaturize while board densities increase, resulting in significant rework challenges. This demands the ability to precisely target heat to reflow the component, without adversely affecting adjacent components.
To meet these challenges, PACE Worldwide announces the MT200 MiniTweez®, a new thermal tweezer designed to quickly and safely rework tightly spaced micro-components such as 0201s, 0402s and 0603s in a simple, one-handed operation. As perfectly aligned tips are critical for success, the MT-200 features multiaxis tip alignment capability. A Tip-Gap Adjustment Wheel allows the operator to match the gap between the tips to the work thus reducing grip stress and operator fatigue, particularly during repetitive operations. In addition, the MT-200 can also provide safe, rapid removal of much larger chips and components such as SOTs, D-PAKs, SOICs and TSOPs.