SMTA Releases Selective Soldering 101 Online Training Course


Reading time ( words)

The Surface Mount Technology Association (SMTA) announced the recent release of Selective Soldering 101, the latest in a series of online training courses on the fundamentals of electronics assembly. The course will be useful for equipment operators, technicians, and engineers new to the industry that want to understand more about the soldering process and who have a basic familiarity with the equipment. 

Course instructor and industry veteran, Bob Willis, addresses the entire Selective Soldering Process including Components & Design Rules, Why Selective Soldering, Fluxing Process, Pre-Heating & Profiling, Selective Solder Inspection, as well as Selective Soldering Defects - Causes & Cures. This course focuses specifically on the types of selective soldering using single point, mini wave or multiple small waves.

Selective Soldering 101 was developed by Bob Willis and peer-reviewed by Martin Anselm, Rochester Institute of Technology (RIT); Richard Boyle, Henkel; and Nigel Burtt, Renishaw. Content for the course was provided by Joe Clure, Kurtz Ersa; Gerjan Diepstraten, Soltec; Heike Schlessmann, Seho; Chris Williams, Solderstar; and Bob Willis, SMTA Europe.

The SMTA Training Committee is responsible for developing and reviewing all course materials for the SMTA online training program. Hands on, on-site workshops can also be arranged through SMTA. 

For more information about SMTA online training, visit https://www.smta.org/training, or contact SMTA Director of Communications Ryan Flaherty at +1-952-920-7682 or ryan@smta.org.

SMTA – A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.