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ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment. The Momentum II 100 is a hard-working, value-priced printing machine with a modest footprint utilizing the same robust Momentum platform proven in top facilities around the world. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.
Both new models feature a fresh cover set with a larger widow and wider access inside the printer. The quick-release squeegee makes changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade. A new patent-pending jar dispenser is available in addition to the standard cartridge dispenser. The operating software has been upgraded to Window 10 and has new production tools and QuickStart™ programming that make it even more powerful and easier to use.
One of the key new features available in all Momentum II printer models is a new paste management system that provides innovative tools to improve yield and enable Industry 4.0 traceability. The system includes an industry-first paste temperature monitor, measured for proper paste viscosity and a roll height monitor that now measures both upper and lower limits. All data can be recorded for board traceability. This system will improve yield and reduce waste by ensuring proper paste viscosity to avoid bridging and voiding and eliminate insufficient or excess paste volumes.
“We are currently accepting orders for the Momentum II BTB and 100 models,” said Wayne Wang, MPM Business Manager. “The Momentum II features many exciting new features that will bring added value to SMT manufacturers in the automotive, semiconductor and smart device markets.”