Pillarhouse Working With The Electronics Industry To Fight COVID-19


Reading time ( words)

Pillarhouse International is pleased to be supplying Selective Soldering Systems to a number of key, UK-based, electronic equipment manufacturers to help in the battle to defeat COVID-19 (Coronavirus). This week they will deliver two new Jade Mk II and PillarGEN nitrogen systems to DVR Ltd and an additional PillarGEN nitrogen system to Jaltek Systems. Along with another Pillarhouse customer, Nemco Ltd, these companies are all helping in the manufacture of life-saving ventilators. 

Whilst Pillarhouse is currently operating greatly reduced staffing levels, due to the UK government’s isolation policy, these Selective Soldering Systems have been assembled and tested from scratch in less than 5 days. Managing Director, Nigel Monk, said “I believe that it is very important that Pillarhouse can help play an active role in helping tackle COVID-19.” He went on to say “I am immensely proud of our Pillarhouse employees, who stepped up and helped, get this equipment out so quickly.” 

Share




Suggested Items

EPTAC Primed for SMTA International

10/19/2022 | Andy Shaughnessy, I-Connect007
I recently spoke with Leo Lambert, vice president of technology for EPTAC, about the training company’s newest classes and his plans for the upcoming SMTA International. The event, co-located with the Medical Device & Manufacturing (MD&M) Show, takes place in Minneapolis Oct. 31—Nov. 3. It’s never a dull moment in this industry and Leo takes a few minutes to talk about his company’s certification efforts, what’s planned for SMTAI, and where some of this technology is headed. Swallowing a pill that measures diagnostics? It’s a great time to be in the industry.

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.