Center for Electronics Manufacturing & Assembly Receives MIRTEC AOI Equipment

Reading time ( words)

Rochester Institute of Technology recently installed a MIRTEC MV-3 OMNI automated optical inspection (AOI) machine in its Center for Electronics Manufacturing and Assembly (CEMA). The equipment enables researchers and manufacturers to better inspect transistors that must be methodically aligned on printed circuit boards used in electronic devices such as smart phones, game consoles and computer systems.

“Automated optical inspection equipment can determine the precise placement of thousands of small parts and ensure they are properly attached during the manufacturing process where many devices are being produced in assembly,” said Martin Anselm, director of CEMA.

“You are not just placing one of these transistors, you are putting on hundreds. And in a 24-hour period, if you are producing many cellphones, you are putting down tens of thousands of these little parts that no human eye can really see all that well,” said Anselm, who also is a faculty-researcher in RIT’s College of Engineering Technology. “The CEMA lab is helping to enable these newer technologies because we are studying the manufacturing process of these highly advanced designs.”

Current electronics assembly requires automated optical inspections rather than slower, manual inspections to identify parts and validate proper attachments.

“We have three main categories of users in the CEMA lab—students, faculty, corporate partners. The center and corporate partners such as MIRTEC want students to have exposure to the latest equipment in the industry. They want researchers to have the ability to research advanced manufacturing topics, and they want industry partners to be able to have access to this equipment for R&D.”

Brian D’Amico, President of MIRTEC’s North American Sales and Service Division agreed, “We are very pleased to partner with RIT. This is of the most advanced manufacturing facilities of any university in the world providing equipment, capabilities and technical expertise to help manufacturers improve process yields and productivity.”

RIT and MIRTEC also have formed a research partnership that allows MIRTEC to use the lab for demonstrations purposes and refer customers to CEMA for inspection services. Students in RIT’s manufacturing and mechanical engineering technology department will gain experience with the state-of-the-art 3D Inspection Equipment.

CEMA was established in 1995 and provides workforce training, development, prototype testing and research for the electronics manufacturing and packaging industry. The MIRTEC equipment, valued at $145,000, will further RIT’s overall contributions to AIM Photonics, specifically in the areas of next-generation electronics devices and packaging.

About RIT
Rochester Institute of Technology is home to leading creators, entrepreneurs, innovators and researchers. Founded in 1829, RIT enrolls about 19,000 students in more than 200 career-oriented and professional programs, making it among the largest private universities in the U.S. The university is internationally recognized and ranked for academic leadership in business, computing, engineering, imaging science, liberal arts, sustainability, and fine and applied arts. RIT also offers unparalleled support services for deaf and hard-of-hearing students. The cooperative education program is one of the oldest and largest in the nation. Global partnerships include campuses in China, Croatia, Dubai and Kosovo. For news, photos and videos, go to To follow RIT on social media, go to

MIRTEC has earned a solid reputation as one of the most progressive and dynamic suppliers of Inspection Equipment to the Electronics Manufacturing Industry. For more information about MIRTEC’s Technologically Advanced 3D Inspection Systems, please visit:


Suggested Items

Big Data Can Bring Your Business Back

04/20/2022 | Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?

José Servin Receives IPC Dieter Bergman Fellowship Award

03/23/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.

Doug Pauls, Collins Aerospace, Receives Dieter Bergman IPC Fellowship Award

03/16/2022 | Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.

Copyright © 2022 I-Connect007. All rights reserved.