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BTU International, Inc., a leading supplier of advanced thermal processing equipment for electronics manufacturing, is pleased to announce that Fred Dimock, manager of process technology, will host a webinar with the SMTA on Tuesday, May 26, 2020 from 10−11 a.m. CST.
This webinar is based on the solder reflow fundamentals class and reflow section of the Jump Start Program that was presented at SMTA International Rosemont, IL. It is designed for the new SMT engineers/technicians or current engineers who want a better understanding of the reflow process. It discusses recipes vs. profiles, heat transfer in a reflow oven, oven control, why profiles are shaped the way they are, and how to obtain profiles. Additional topics of discussion include TC accuracy and mounting, profilers, test vehicles and process windows.
Dimock has taught numerous SMTA solder reflow classes and has participated in the 5-45 subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. He wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr. Lasky and Jim Hall.
Dimock holds an associate’s degree in Mechanical Design from Wentworth in Boston and a bachelor’s degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). He has been recognized as a Distinguished Speaker status at SMTA Guadalajara and received several Best Vendor Presentation awards at the SMTA East China conferences.
Nolan Johnson, I-Connect007
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Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
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