JAVAD EMS Installs Leading Rework Technology from VJ Electronix, Inc.

Reading time ( words)

JAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, announces that it has purchased and a Summit 1800i from VJ Electronix, Inc. for its facility in Silicon Valley. The industry’s leading rework technology has been installed at JAVAD adds the industry’s leading rework technology with recent refinements for ultra-small components like 01005s, while maintaining its capabilities with large boards, oversized CPU sockets, connectors and large BGAs up to 120x120 mm.

Gary Walker, Vice President of JEMS stated: “We decided the Summit 1800i was the ideal choice to support our new large board line. The proven repeatability and reliability of the Summit in all aspects of the rework process instills confidence that the results will meet the demands of today’s highly complex technologies.”

The Summit 1800i incorporates all of the features required for current and future rework applications. Triple stage convection heating provides the flexibility to rework a wide range of products including very large high-density assemblies. The addition of Top Heater Boost provides programmable increased power and flow through the Top Heater. This can result in reduced peak component temperatures and time above liquidus to meet very strict specifications and limits. This feature is key to maintaining the integrity of costly PWBs and components.

The same 1800i system can also rework components as small as 01005 as well as through hole components. The Sierramate software contributes by providing auto profiling tools to successfully generate thermal profiles without the guess work. At the same time, the same software walks the operator through the procedures to successfully complete the rework operation with minimal intervention.

JEMS has more than 40,000 sq. ft. manufacturing space that it continually updates to the highest standards of electronic manufacturing services, communication, client support, employee comfort and training. The company’s surface-mount-technology (SMT) lines are complete with inline three-dimensional (3D) solder paste inspection and AOI complimented by fully automated 3D X-ray for solder joint inspection.

JEMS’ manufacturing lines are highly flexible, allowing for diverse and complex products using the latest in component packaging technologies to be assembled and with quick changeover between products, enabling high-mix, low to medium volume production.



Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

This Month in SMT007 Magazine: Test and Measurement in a Smart Factory

11/03/2020 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.

Copyright © 2020 I-Connect007. All rights reserved.