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Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, is proud to present the new 3D solder paste inspection (SPI) solution TR7007D/Q Plus.
The TR7007D/Q Plus 3D SPI platform is equipped with an improved motion controller (EtherCat) and an enhanced 2D light module. The new motion controller achieves real-time measurements and processing on the fly while the new light module realizes higher uniformity inspection, less shadow, and improved imaging.
The TR7007D/Q Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/Q Plus is equipped with up to four projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.