Schmartboard Announces Solution to Improve Circuit Joint Reliability


Reading time ( words)

Over the past couple of decades, two of the biggest concerns in the electronics manufacturing market has been increased failure of solder joints, especially in harsher physical environments and a battle to keep manufacturing yields higher.

There are 3 main reasons for this trend. The first is a move away from though-hole devices and established wave soldering techniques to the proliferation of surface mount technology. Secondly is the continued miniaturization of the surface mount components. Lastly, if not most profoundly, is the move away from lead in the solder joint to a more brittle substitute to adhere to RoHS requirements. Add to this the proliferation of portable devices which can be subject to drop/shock failures.

Schmartboard believes that an existing patent, created for prototyping applications, is an excellent solution for mass production circuit assembly reliability providing a significant improvement in manufacturing yields. This is accomplished without change to raw materials such as solder or components. Schmartboard has begun the process of redefining and bolstering existing patents to reflect this quality improvement process.

Schmartboard will be looking for an interested partner to bring the benefits of these patents to fruition. Companies who need a solution to improve circuit joint reliability and manufacturing yields should contact the company.

For more information and to be considered as a partner in the endeavor, interested parties should go to www.schmartboard.com/schmartreliability.

About SchmartBoard

SchmartBoard™ is committed to helping make the development of electronic circuits faster, easier, and less expensive than previously possible. SchmartBoard's patented "EZ" Technology makes hand soldering of surface mount components for prototyping, fast and flawless. Schmartboard is hard at work to also bring revolutionary solutions for mass production of circuit assemblies to the marketplace 

Share

Print


Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

This Month in SMT007 Magazine: Test and Measurement in a Smart Factory

11/03/2020 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.



Copyright © 2020 I-Connect007. All rights reserved.