Schmartboard Announces Solution to Improve Circuit Joint Reliability

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Over the past couple of decades, two of the biggest concerns in the electronics manufacturing market has been increased failure of solder joints, especially in harsher physical environments and a battle to keep manufacturing yields higher.

There are 3 main reasons for this trend. The first is a move away from though-hole devices and established wave soldering techniques to the proliferation of surface mount technology. Secondly is the continued miniaturization of the surface mount components. Lastly, if not most profoundly, is the move away from lead in the solder joint to a more brittle substitute to adhere to RoHS requirements. Add to this the proliferation of portable devices which can be subject to drop/shock failures.

Schmartboard believes that an existing patent, created for prototyping applications, is an excellent solution for mass production circuit assembly reliability providing a significant improvement in manufacturing yields. This is accomplished without change to raw materials such as solder or components. Schmartboard has begun the process of redefining and bolstering existing patents to reflect this quality improvement process.

Schmartboard will be looking for an interested partner to bring the benefits of these patents to fruition. Companies who need a solution to improve circuit joint reliability and manufacturing yields should contact the company.

For more information and to be considered as a partner in the endeavor, interested parties should go to

About SchmartBoard

SchmartBoard™ is committed to helping make the development of electronic circuits faster, easier, and less expensive than previously possible. SchmartBoard's patented "EZ" Technology makes hand soldering of surface mount components for prototyping, fast and flawless. Schmartboard is hard at work to also bring revolutionary solutions for mass production of circuit assemblies to the marketplace 


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