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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Timothy O’Neill to the position of Director of Product Management.
As AIM’s Director of Product Management, Timothy’s new role will include managing products throughout the product life cycle, gathering and prioritizing product and customer requirements, defining the product vision, and working closely with the R&D team to continue developing world-class solder products.
With over 25 years of experience in the solder industry, Timothy has co-authored several papers on PCB assembly subjects. He is a Certified IPC Specialist, a technical writer and presenter for industry trade publications and events. His commitment and dedication to sharing innovative solutions to challenging problems in the electronics assembly market have earned him recognition from the SMTA as Speaker of Distinction.
“This is a very important and exciting new role for both Tim and the company,” said AIM’s Executive Vice President, David Suraski. “Tim has been a valuable resource for AIM customers for many years and we are confident that he will excel in his new role and look forward to his valuable contributions.”
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
I-Connect007 Editorial Team
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”