CE3 Electronics Inc. Selects MIRTEC for Continuous Quality Improvement

Reading time ( words)

MIRTEC, a ‘Leading Global Supplier’ of Technologically Advanced 3D Inspection Systems to the Electronics Manufacturing Industry, is pleased to announce that CE3 Electronics Inc., a World-Class EMS provider specializing in advanced printed circuit board assembly and complex cable and wire harness manufacturing, has selected MIRTEC as their 3D AOI partner with the purchase of an MV-6 OMNI 3D AOI Machine.

“CE3 Electronics Inc. is a World-Class Electronics Manufacturing Services provider specializing in advanced printed circuit board assembly and complex cable and wire harness manufacturing.  Our company continually invests in state-of-the-art manufacturing equipment to ensure that our clients consistently receive the highest quality PCB assemblies.  As part of our commitment to Continuous Quality Improvement, CE3 recently purchased a new MIRTEC MV-6 OMNI 3D AOI machine.  I am pleased to report that our operators and inspectors are extremely impressed with the superior performance and accuracy of this system.  MIRTEC’s revolutionary OMNI-VISION® 3D Inspection Technology drastically reduces the number of false calls and has enabled us to virtually eliminate visual solder inspection.  The comprehensive SPC analysis software is easy to use and provides actionable process information to our quality personnel.  CE3 would highly recommend MIRTEC to any company considering the purchase of a 3D AOI machine”, stated Shawn Aucoin, Engineering Manager, CE3 Electronics Inc.

“Electronic Manufacturers are becoming ever more selective in purchasing equipment that will add value to their business and provide them with a much-needed edge in this highly competitive industry,” said Brian D’Amico, President of MIRTEC Corp. “An overwhelming number of OEM and EMS providers are relying upon MIRTEC 3D Automated Optical Inspection (AOI) equipment to help increase profitability by improving production yields and reducing costly rework. We are extremely pleased to have been awarded CE3’s 3D AOI business.  It is truly a pleasure to continue our long-standing partnership with the outstanding team at CE3.”

MIRTEC’s award-winning MV-6 OMNI 3D AOI Machines are configured with the company’s exclusive OMNI-VISION® 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera System with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D Technology to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow.  Fully configured the MV-6 OMNI machine features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.

For further information about MIRTEC’s market leading inspection solutions, please visit www.mirtec.com.


Suggested Items

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.

Optimizing Test Engineering Practices for High-Mix Electronics Manufacturing

08/01/2022 | Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.

Time to Get Serious About CMMC Readiness

07/13/2022 | I-Connect007 Editorial Team
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”

Copyright © 2022 I-Connect007. All rights reserved.