Dow Introduces Easy-To-Dispense Gap Filler for Efficient Assembly


Reading time ( words)

Dow introduced new DOWSIL™ TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities. This two-part TIM and gap filler allow electronic designers to replace traditional, fabricated pads of various thicknesses with a single UL 94 V-0 material for dispensing or printing through a choice of manual and automated processes. New DOWSIL™ TC-4040 Dispensable Thermal Pad supports either room temperature or accelerated curing and delivers highly reliable thermal and mechanical performance.

“Thermal interface materials for telecom and network equipment and other advanced devices need to dissipate significant amounts of heat in 5G network and cloud computing systems,” said Samuel Liu, marketing manager and segment leader, Dow. “At the same time, manufacturers need new material solutions that enable reduced labor costs and more efficient assembly. Our new DOWSIL™ TC-4040 Dispensable Thermal Pad is an innovative addition to Dow’s strong and growing portfolio of thermally conductive materials. Its launch underscores Dow’s ongoing commitment to its customers to develop cutting-edge materials that provide a precise balance of properties for outstanding thermal and mechanical performance.”

Dow’s new DOWSIL™ TC-4040 Dispensable Thermal Pad supports automated dispensing, stencil printing and screen printing. Piston pump and plunger metering is recommended for dispensing because of the material’s high filler loading. DOWSIL™ TC-4040 Dispensable Thermal Pad offers a superior extrusion rate and delivers precise component coverage with needle dispensing. This high thermally conductive material (4.0W/mk) has a working time of two to four hours.

DOWSIL™ TC-4040 Dispensable Thermal Pad is a reworkable gap filler that is supplied as a two-part liquid component kit and has a shelf life of up to six months at room temperature due to its dependable material properties and ease-of-storage. It has excellent reliability of thermal management performance that can resist various harsh environmental testing (e.g. 1000-hour aging test at 150C, 1000 cycles thermal shock from -45C to 125C and 1000-hour 85/85% RH (high-temperature/high-humidity) aging test).

DOWSIL™ TC-4040 Dispensable Thermal Pad is available in Greater China and throughout Dow’s extensive global network of distribution partners.

Share

Print


Suggested Items

Just Ask Eric: Nano-Coating on Stencils?

09/17/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes. Today's question involves the use of nano coatings on stencils.

Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields

09/16/2020 | Real Time with...SMTAI
KYZEN Executive Vice President Tom Forsythe shares company updates on stencil cleaning with Nolan Johnson. KYZEN recently announced its newest stencil cleaning product—KYZEN E5631. Forsythe details how the product is best used, as well as the benefits it brings to maximizing stencil life and improving manufacturing yields.

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

06/19/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.



Copyright © 2020 I-Connect007. All rights reserved.