Dow Introduces Easy-To-Dispense Gap Filler for Efficient Assembly


Reading time ( words)

Dow introduced new DOWSIL™ TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities. This two-part TIM and gap filler allow electronic designers to replace traditional, fabricated pads of various thicknesses with a single UL 94 V-0 material for dispensing or printing through a choice of manual and automated processes. New DOWSIL™ TC-4040 Dispensable Thermal Pad supports either room temperature or accelerated curing and delivers highly reliable thermal and mechanical performance.

“Thermal interface materials for telecom and network equipment and other advanced devices need to dissipate significant amounts of heat in 5G network and cloud computing systems,” said Samuel Liu, marketing manager and segment leader, Dow. “At the same time, manufacturers need new material solutions that enable reduced labor costs and more efficient assembly. Our new DOWSIL™ TC-4040 Dispensable Thermal Pad is an innovative addition to Dow’s strong and growing portfolio of thermally conductive materials. Its launch underscores Dow’s ongoing commitment to its customers to develop cutting-edge materials that provide a precise balance of properties for outstanding thermal and mechanical performance.”

Dow’s new DOWSIL™ TC-4040 Dispensable Thermal Pad supports automated dispensing, stencil printing and screen printing. Piston pump and plunger metering is recommended for dispensing because of the material’s high filler loading. DOWSIL™ TC-4040 Dispensable Thermal Pad offers a superior extrusion rate and delivers precise component coverage with needle dispensing. This high thermally conductive material (4.0W/mk) has a working time of two to four hours.

DOWSIL™ TC-4040 Dispensable Thermal Pad is a reworkable gap filler that is supplied as a two-part liquid component kit and has a shelf life of up to six months at room temperature due to its dependable material properties and ease-of-storage. It has excellent reliability of thermal management performance that can resist various harsh environmental testing (e.g. 1000-hour aging test at 150C, 1000 cycles thermal shock from -45C to 125C and 1000-hour 85/85% RH (high-temperature/high-humidity) aging test).

DOWSIL™ TC-4040 Dispensable Thermal Pad is available in Greater China and throughout Dow’s extensive global network of distribution partners.

Share

Print


Suggested Items

Northrop Grumman: 3D Nanomaterials May Counter Gaps in Additive Supply Chain

10/22/2020 | Andy Shaughnessy, Design007 Magazine
The best technology is dead in the water if your domestic supply chain won’t support it. That was just one of the takeaways from Dr. Judy Dickson’s talk during the SMTA Additive Electronics TechXchange. In her presentation, titled “Advanced PWBs: A Collaboration Between Design, Operations, and the Supply Chain,” Dickson, a senior principal systems engineer at Northrop Grumman Mission Systems, laid out the many challenges her department faces in fielding HDI advanced packaging into the next decade. Most of these challenges are related to sourcing the necessary materials in the U.S.

Increase Traceability, Prevent Counterfeiting

08/25/2020 | I-Connect007 Editorial Team
Michael Ford, senior director of emerging industry strategy for Aegis Software and I-Connect007 columnist, speaks about the increasing importance of traceability in manufacturing and throughout the supply chain, including how it affects such areas as counterfeit components and inventory management.

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.



Copyright © 2021 I-Connect007. All rights reserved.