GOEPEL electronic Presents New Series of Affordable 3D AOI Systems


Reading time ( words)

Large and small electronics manufacturers are subject to relentless demands for reduced cost and improve quality. To meet these demands the GOEPEL electronic has launched two new Automatic Optical Inspection Systems. The 3D XE series of AOI platforms are characterised by low acquisition costs whilst still delivering full 3D inspection functionality.

The series consists of the stand-alone system Basic Line · 3D XE and the inline system Advanced Line · 3D XE. Flexible interfaces such as Hermes or PULSE allow production line integration of the inline version; for smaller quantities, the offline 3D AOI system with manual loading is an attractive solution. In addition, both systems can be used as full 3D solder paste inspection systems (SPI). Thus configuration as an inspection island offers a highly efficient and flexible production environment. (especially for the Advanced Line · 3D XE).

3D XE series platforms are controlled using the latest PILOT AOI software and MagicClick for AI-based, fully automatic creation and optimization of inspection programs. This functionality enables the system to inspect new assemblies within a few minutes and without any component library. For manufacturing service providers with a large variety of products this is especially important. It guarantees a high degree of cost-effective use even for the smallest of board quantities and saves up to 80% of program creation and optimization time.

Share

Print


Suggested Items

Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview

06/19/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.

MTV Offers Solder Paste Testing Solution

06/17/2020 | Nolan Johnson, I-Connect007
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

TQM: The Tyranny of the Urgent

06/10/2020 | I-Connect007 Editorial Team
The I-Connect007 editorial team recently spoke with Dr. Ron Lasky about what’s stopping companies from improving their processes, especially regarding productivity.



Copyright © 2020 I-Connect007. All rights reserved.