Johnson Outoors Installs AssureTM X-ray Component Counter


Reading time ( words)

Johnson Outdoors, Inc., a fully integrated high technology manufacturing, assembly, and shipping facility, has recently installed the Nordson DAGE Assure™ X-ray component counter in their Humminbird Complex in Eufaula.

Humminbird maintains a state of the art manufacturing facility, with world class capabilities, focusing on Printed Circuit Board Manufacture and Assembly, Mechanical Assembly, and Supplier partnerships for critical assemblies and parts.

“Having an accurate and reliable component inventory management system as part of our SMD production enables us to quickly, and easily perform cycle counts and enables us to increase productivity, minimize component errors, and shortages” stated Peter J. Walker, Production Engineering Manager for Johnson Outdoors. “More critically, having the peace of mind that we get from minimizing stock, labor, and errors ensures confidence and trust for every job. Assure provides a smooth, reliable, and cost effective model for managing our component inventory”.

Inventory knowledge is essential for modern industry. Whether you are a SMT manufacturer, supplier or broker, live assurance of correct inventory in your MRP system at all times minimizes stock, labor, errors and costs ensuring customer confidence and trust. Keep your SMT lines running.

AssureTM is the fastest, simplest and most reliable way to implement live component inventory management into your organization. Intelligent, simple, fast, and trustworthy, Assure enables you to increase productivity and minimize component shortage downtime.

Share

Print


Suggested Items

Digi-Key on Adapting to the Changing Industry Landscape, Pt. 1

11/26/2019 | I-Connect007 Editorial Team
The I-Connect007 editorial team recently spoke with Chris Beeson, executive vice president of global supplier and new business development at Digi-Key Electronics, about trends and the changing landscape of the industry. Beeson describes how Digi-Key is looking to continue growing its user community as a design service provider while providing greater services for the entire PCB.

Cavity Board SMT Assembly Challenges (Part 2)

07/03/2019 | Dudi Amir and Brett Grossman, Intel Corporation
This article describes the details of a study of assembling SiP BGA packages into a cavity. It points out the challenges involved in the board cavity design and assembly of components in a cavity. The authors discussed the board design challenge of having a cavity and defining the proper depth of the cavity to accommodate the board fabricator, the product design, and the SMT assembly.

IPC SummerCom Highlights: A Government Relations Perspective

06/27/2019 | Chris Mitchell, IPC VP, Global Government Relations
Last week, IPC hosted SummerCom, our semi-annual standards development committee meetings, in Raleigh, North Carolina. The event brought together thousands of technical experts from around the world to shape the product, manufacturing, and supply-chain standards that guide our industry.



Copyright © 2020 I-Connect007. All rights reserved.