Dymax Introduces Multi-Cure 9037-F Encapsulant for Printed Circuit Board Assembly


Reading time ( words)

Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure® 9037-F. The product cures in seconds upon exposure to UV/Visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards.

The material features improved flexibility and resiliency for a variety of glob-top, chip-on-board, chip-on-flex, chip-on-glass, and wire-tacking/bonding applications. It is well-suited for encapsulation of critical components on flexible and rigid circuit board materials such as FR-4, Kapton®, and glass, and contains no sharp, abrasive, mineral, or glass fillers to abrade fine wires.

Multi-Cure 9037-F has excellent moisture and thermal resistance, making it a good candidate for use as a corrosion guard for wire-bond connections in battery management systems. Additional uses include encapsulation of components on circuit boards found in automotive ADAS and infotainment systems, aerospace and defense applications, and consumer electronics. Formulated with blue fluorescing technology, the material is highly visible on encapsulated PCB modules when exposed to low-intensity black light for easy visual quality inspection.

Share




Suggested Items

Turn E-textiles Concepts Into Real-World Products

01/10/2023 | Julia Gumminger, IPC
IPC E-Textiles 2023 is an international forum for materials suppliers, product designers, manufacturers, technical experts, and company executives from around the world to collaborate on all areas of the supply chain for e-textiles technologies in the fashion design, health and medical, sports and athletics, automotive, and military and aerospace sectors. It takes place Monday, Jan. 23, in conjunction with IPC APEX EXPO. This year’s event will feature informative and engaging presentations encompassing all areas of e-textiles, Q&A discussions with presenters, and a panel discussion on the economic and business aspects of e-textiles.

Essemtec: Manufacturing Moves In-house

12/28/2022 | Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.

Intermingling Semiconductor and PCB Machine Capabilities

12/14/2022 | Nolan Johnson, I-Connect007
In the midst of electronica, which included the co-hosted SEMICON show, Nolan Johnson speaks with Koh Young’a Harald Eppinger about the convergence of capabilities in the IC and PCB lines at Koh Young. In addition, Eppinger points out that while there are similarities between the global regions of production, there also are unique requirements.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.