-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ViTrox Introduces New Advanced 3D Solder Paste Inspection Solution
July 9, 2020 | ViTrox TechnologiesEstimated reading time: 2 minutes
ViTrox Technologies, a world-leading solution provider of innovative, advanced and cost-effective Automated Machine Vision inspection system and equipment for the Semiconductor and Electronics Assembly industries, is pleased to introduce the V310i Advanced 3D Solder Paste Inspection System (API) designed to cater for the need of integrated vision solution for Smart Manufacturing.
The Advanced 3D Solder Paste Inspection Solution plays an essential role in guaranteeing the quality and quantity of the solder paste printing in the SMT line. Solder paste printing is a complicated process and it contributes to defects from many factors. It depends on the volume of particle balls deposited on the pads to achieve a good product.
The V310i API system is a high speed and high-resolution 3D solder paste inspection system that enables high-accuracy inspection with the shortest cycle time. The system is integrated with many technological features, such as Advanced Warpage Compensation, Auto Pads and Component learning, Auto Warpage Mapping capabilities coupled with the machine to machine closed-loop features which have created significant value differentiation from other market players.
In order for users to cover all types of solder paste while the sizes of solder balls are getting smaller and smaller, the vision resolution of inspection becomes challenging than before. Therefore, ViTrox provides customers with the V310i API Solution that offers variable fine lens to prepare for customer selection based on their products for pads measurements of solder deposit. The accuracy of 3D measurement on Area, Volume, Height is able to reduce the rework cost and achieve high-quality product.
ViTrox also offers various solder paste inspection platforms to cover different production needs such as V310i 3D standard, V310i 3D XL and V310i 3D XXL. V310i 3D XL is a brand new model. This model is suitable to serve major industries such as communication, consumer electronics, automotive, medical industries with the capability of handling board weight up to 7 kg and 510 mm x 510 mm board size for Single Lane or 460 mm x 325 mm for Dual Lane. Meanwhile, 95% of V310i API parts are similar with V510i Advanced 3D Optical Inspection (AOI), thus, the V510i AOI and V310i API are able to share the same wear and tear spare parts to reduce the investment cost.
Overall, ViTrox debuts the complete SMT inspection solutions with of Advanced 3D Solder Inspection system that works hand in hand with V510i AOI, V810i Advanced 3D X-Ray Inspection (AXI) and V9i Advanced Robotic Vision (ARV) for the SMT manufacturing line.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.