Balver Zinn Introduces JEAN-151 SN100CV T4 Solder Paste

Reading time ( words)

JEAN-151 is the latest offering from Balver Zinn Josef Jost GmbH & Co. KG, which offers a robust versatile all-round solder paste for a wide variety of applications for consumer, industrial and automotive products.

The halide-free JEAN-151 is classified according to J-STD-004A as ROL0 and is the only solder paste flux formulation that is available with the new high reliability alloy SN100CV®. Currently the JEAN-151, in combination with the SN100CV alloy, is not only available in powder particle size T4 but also in SAC305 alloy and is available in particle sizes T3 to T5.

The SN100CV® is the high reliability variant of the silver-free SN100C® series. The alloy is designed for high reliability applications like e-mobility and its associated requirements and is capable of maintaining the fatigue strength of the solder joint during the aging processes at higher temperature loads.

By adding 1.5% bismuth this produces a stable solid solution strengthening mechanism that results in a premium long-term reliability compared to the precipitation hardening mechanism that is produced by silver (like in SAC305 etc.).

JEAN-151 SN100CV® is a dedicated solder paste for long-term reliability, it exceeds the standard Pb-free alloys reliability standards for industrial and high reliability (automotive) applications.

The patented alloy SN100CV® which does not contain silver is an inexpensive high-reliability alloy for high-end applications that exceeds the reliability of silver containing alloys.

The JEAN-151 SAC305 T4 and the JEAN-151 SN100CV T4 have been subjected to a comparative test in a reflow soldering processes with/without nitrogen and in vapor phase soldering process by Perry Smulders who is team leader in production at the Dutch company ACTEMIUM.

Depending on the soldering process used, there are no significant differences in the formation of reliable solder joints. All processes showed an excellent robust wetting behaviour.

Also, the voiding level of both alloys is constantly on a low level and JEAN-151 shows perfect final test results with both alloys on various products.

The cold slump behavior of the JEAN-151 solder pastes achieves excellent printing results especially in fine-pitch applications. Focus during the development of the JEAN-151 was to avoid beading and eliminate bridging since these soldering anomalies are more common in fine and ultra-fine pitch applications. The hot slump characteristics of the solder paste flux of the JEAN-151 results in consistent production improvements. The residues are clear and do not spread but remain in the immediate proximity of the solder joint which results in a very homogeneous solder joint appearance.

The thermal stability of the solder paste enables the use of a high variety of soldering profiles. JEAN-151 can be offered with a wide variety of possible alloys and is therefore the ideal product for Pb-free processes. In addition to the SN100CV® alloy for high reliability applications, the JEAN-151 in combination with SN100C, SCANGe071 and SAC305 alloy is the ideal solution for standard processes for the consumer, industrial and automotive sector.



Suggested Items

MTV Offers Solder Paste Testing Solution

06/17/2020 | Nolan Johnson, I-Connect007
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

Copyright © 2020 I-Connect007. All rights reserved.