I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.

Medical Device Standard Reaches New Milestone
Published July 6

Passing the ballot after industry review is a major milestone in the development of a standard. IPC-6012 has accomplished this step. Forward progress on standards in medical devices is very topical right now, and readership showed that interest. 

Catching Up With Fane Friberg: Supply Chain Management Expert
Published July 3

“Supply chain” is a key phrase in our sector right now. Everybody is paying attention to the supply chain, and everybody pays attention to Dan Beaulieu, too. So, when Dan interviews a new supply chain subject-matter expert, it was sure to have strong readership.

Understanding MIL-PRF-31032, Part 1
Published July 7

American Standard Circuits’ Anaya Vardya launched a series on MIL-RF-31032 and drew some of the highest readership of the week in just 24 hours. Anaya found a high-interest topic.

AltiumLive 2020 Goes Virtual
Published July 6

Altium’s annual user community conference, AltiumLive, is moving to an online experience this year, like many trade shows and conferences that have responded similarly. This news item makes the top five due to the unique experience that AltiumLive traditionally provides.

Chris Hanson: New Ventec Dialectrics Rated for Higher Temps
Published July 7

With Andy Shaughnessy facilitating the interview, Ventec International Group’s Chris Hanson discusses new IMS materials, including one that is UL-rated for a max operating temperature of 155°C—possibly the highest rating for any IMS dielectric.

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IPC Solder Stencil Task Group—Inviting OEM Input to IPC APEX EXPO Meeting

01/31/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems is chairman of IPC’s Solder Stencil Task Group. In this conversation with Nolan Johnson and Barry Matties, Jeff discusses what they will be meeting about at the upcoming IPC APEX EXPO.

Future of 'Substances and Materials in Products' Data Exchange Formats as Standards

10/16/2019 | Jean-Pierre Theret, Dassault Systèmes
This article provides a simplified, state-of-the-art description of the data exchange formats for standards covering substances and materials reporting in products and processes. It also reviews existing issues and new challenges shared with end users of the standards and companies represented by their trade associations with some solution proposals they could discuss.

Is It Time to Shake Up Materials Standards?

10/02/2019 | I-Connect007 Editorial Team
COO Mark Goodwin and Technology Ambassador Alun Morgan from Ventec International Group describes how they feel current standards do not sufficiently recognize the needs of end customers today with new processes and materials being shoehorned into old standards based on dated ideas of classifications, and how this makes choosing the right material challenging for designers.



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