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Indium Corporation will feature its precision AuSn preforms for high-reliability aerospace applications during the Space Tech Expo Connect virtual exhibition from Aug. 10-13.
Aerospace applications require materials with exacting tolerances that perform well under the most extreme circumstances. Indium Corporation’s suite of leading-edge materials and technology expertise offer solutions for the challenges of today with an eye to those of the future.
Indium Corporation’s AuLTRA® ThInFORMS™—0.00035” thick (0.00889mm or 8.89μm) 80Au20Sn preforms—improve the overall operational efficiency of high-output lasers commonly used by the aerospace industry by helping combat common issues, such as:
- Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
- Poor thermal transfer—the ultra-thin 0.00035” preform reduces bond-line thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device
Indium Corporation’s off-eutectic AuSn alloy options are designed to control wetting and voiding, producing a high-reliability solder joint for critical high-power, high-frequency applications.
Space Tech’s virtual exhibition gives the worldwide aerospace community an opportunity to interact, discuss, and attend webinars and roundtable sessions in a digital environment. For information on this topic or to chat with our experts, visit Indium Corporation’s virtual booth.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.