Indium Corporation to Feature AuSn Precision Preforms at Space Tech Expo


Reading time ( words)

Indium Corporation will feature its precision AuSn preforms for high-reliability aerospace applications during the Space Tech Expo Connect virtual exhibition from Aug. 10-13.

Aerospace applications require materials with exacting tolerances that perform well under the most extreme circumstances. Indium Corporation’s suite of leading-edge materials and technology expertise offer solutions for the challenges of today with an eye to those of the future.

Indium Corporation’s AuLTRA® ThInFORMS™—0.00035” thick (0.00889mm or 8.89μm) 80Au20Sn preforms—improve the overall operational efficiency of high-output lasers commonly used by the aerospace industry by helping combat common issues, such as:

  • Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
  • Poor thermal transfer—the ultra-thin 0.00035” preform reduces bond-line thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device

Indium Corporation’s off-eutectic AuSn alloy options are designed to control wetting and voiding, producing a high-reliability solder joint for critical high-power, high-frequency applications.

Space Tech’s virtual exhibition gives the worldwide aerospace community an opportunity to interact, discuss, and attend webinars and roundtable sessions in a digital environment. For information on this topic or to chat with our experts, visit Indium Corporation’s virtual booth.

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com

Share




Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.



Copyright © 2022 I-Connect007. All rights reserved.