Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

DOCOMO, NTT, NEC and Fujitsu Develop Top-level Sub-terahertz 6G Device

04/12/2024 | JCN Newswire
NTT DOCOMO, INC., NTT Corporation, NEC Corporation and Fujitsu Limited jointly announced today the development of a top-level (1) wireless device capable of ultra-high-speed 100 Gbps transmissions in the 100 GHz and 300 GHz sub-terahertz bands.

GEN3 to Demo SIR Testing, Stencil Cleaning & More with Horizon Sales at IPC APEX 2024

03/07/2024 | Gen3
Gen3, global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, to announce its participation in the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. At booth 3934, GEN3 will be exhibiting alongside Horizon Sales, presenting a lineup of advanced technologies aimed at enhancing the efficiency and reliability of circuit assembly processes.

Creation Technologies Launches LEAP Program: Delivering Industry Leading New Product Realization Capabilities

12/11/2023 |
As an established contract design and manufacturing partner for leading medical & life science, tech industrial, and aerospace & defense OEMs, Creation has developed the LEAP program to enhance New Product Realization.

Creation Technologies Launches LEAP Program: Delivering Industry Leading New Product Realization Capabilities

12/07/2023 | Creation Technologies
As an established contract design and manufacturing partner for leading medical & life science, tech industrial, and aerospace & defense OEMs, Creation has developed the LEAP program to enhance New Product Realization.

DELO: New Semicon Adhesive Propels Autonomous Driving Forward

10/20/2023 | DELO
DELO has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in