Electronic Systems Inc. Adds Fuji AIMEX Surface Mount Equipment


Reading time ( words)

Electronic Systems, Inc. is pleased to announce the purchase and installation of two new Fuji AIMEX II surface mount placement machines. In order to keep up with increasing demands, Electronic Systems, Inc. will not only increase surface mount placement capacity and improve flexibility but also meet customers’ increasingly diverse product needs.

“We are very pleased to partner with Fuji once again to enhance our surface mount capabilities," said Gary Larson, President of ESI.  "This addition of new equipment will further advance our services for our customers and the markets we serve.  From our experience, Fuji has always been viewed as the leader in SMT placement technology and they continue to be our trusted source for our SMT equipment.”

The FUJI AIMEX series is an all-in-one versatile machine capable of high-mix production. Interchangeable & reconfigurable placement heads, extremely large feeder capacity, large panel support along with flexibility allows flexible production in a variety of sectors.

Fuji America Corporation (www.fujiamerica.com) headquartered in Vernon Hills, IL, is the leader in surface mount technology (SMT) equipment, providing mix line solutions, capable of both high and low-volume production.

Share

Print


Suggested Items

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.

Cavity Board SMT Assembly Challenges (Part 1)

06/26/2019 | By Dudi Amir and Brett Grossman, Intel Corp.
The concept behind Component-in-Cavity (CiC) is straightforward. If the tallest component(s) on the motherboard can be placed into a recession created in the motherboard, their thickness relative to the components on the surface of the PCB will thus effectively be reduced. While this concept may be straightforward, its implementation is not. That implementation is the focus of this paper. Read on.

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.



Copyright © 2020 I-Connect007. All rights reserved.