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The International Wafer-Level Packaging Conference and Expo is going virtual for 2020 and registration for virtual exhibit space and sponsorships is now open for interested suppliers to the semiconductor and packaging industry. While technical conference access will be available to attendees from October 13-30, 2020, the real-time, virtual exposition will take place October 13-14, 2020.
Exhibiting companies receive a complete package to effectively promote their brand and products to all attendees. This includes a display of a company logo, description, featured products, videos, links to social media, datasheets, booth raffles/giveaways, direct links from conference speakers/presentations, as well as full analytics and reporting following the event. Live chat is available over October 13-14, 2020 during which attendees will have a chance to use either message or video chat to interact with exhibitors in real-time. The exposition and all virtual booths will be available to attendees on-demand until October 30, 2020.
Several sponsorship and advertising opportunities are available to increase brand visibility throughout the virtual conference and expo hall as well as on the website and in communications leading up to the event. Please see the event website for more information on these.
Attendees typically include Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, and other professionals from the semiconductor and electronics packaging industries.