TopLine Files for US Patent for Pb-free Solder Column


Reading time ( words)

TopLine Corporation announced that Martin Hart, CEO of TopLine and inventor, has filed for a US Patent for a lead (Pb) free solder column used in the manufacture of Field Programmable Gate Array (FPGA) devices. The unique new product has been developed in anticipation of RoHS requirements for Pb free columns.

In making the announcement, Hart said, “Historically, the aerospace and defense industry has largely been exempt from meeting the requirements of the EU RoHS directive regulating the use of lead in solder columns. It is widely speculated that one day, RoHS will stop renewing its exemption allowing lead bearing solder balls and solder columns. Doing so could trigger unintentional consequences by forcing Original Design Manufacturers (ODMs) to convert to fully lead-free FPGA products. This product is designed to anticipate and meet future needs for lead-free columns.”

Heritage hardware used in the Aerospace and Defense industries are built on a platform of FPGA devices built with solder columns instead of solder balls, Hart adds. Column Grid Array (CGA) FPGA packages engaged in mission-critical black box systems have shown to be more reliable than Ball Grid Array (BGA) packages, absorbing stress and increasing solder joint reliability under harsh operating conditions.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.